Inventor · disambiguated record
Junji Noguchi
Also filed as: NOGUCHI JUNJI
57 granted patents·12 pending applications·1,297 citations·filing 1998–2019
99Inventor score
Files withRENESAS TECH CORP28HITACHI LTD20RENESAS ELECTRONICS CORP10NOGUCHI JUNJI7MATSUMOTO TAKASHI1
Top patents by PatentIndex Score
69 records- 0198US6184143B1Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 1998·Granted Feb 6, 2001·342 cites·25 claims
- 0296US6731007B1Semiconductor integrated circuit device with vertically stacked conductor interconnectionsHITACHI LTD·Filed 2000·Granted May 4, 2004·85 cites·50 claims
- 0393US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0493US7501347B2Semiconductor device and manufacturing method of the sameHITACHI LTD·Filed 2006·Granted Mar 10, 2009·23 cites·11 claims
- 0593US6723631B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Apr 20, 2004·93 cites·39 claims
- 0692US6818546B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Nov 16, 2004·50 cites·35 claims
- 0791US8420528B2Manufacturing method of a semiconductor device having wiringsNOGUCHI JUNJI·Filed 2009·Granted Apr 16, 2013·20 cites·11 claims
- 0891US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0991US6908847B2Method of manufacturing a semiconductor device having an interconnect embedded in an insulating filmRENESAS TECH CORP·Filed 2002·Granted Jun 21, 2005·46 cites·17 claims
- 1090US8247902B2Semiconductor device and manufacturing method of the sameNOGUCHI JUNJI·Filed 2011·Granted Aug 21, 2012·10 cites·12 claims
- 1190US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 1289US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 1389US6890846B2Method for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted May 10, 2005·38 cites·40 claims
- 1489US6764950B2Fabrication method for semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Jul 20, 2004·38 cites·12 claims
- 1588US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 1688US7387957B2Fabrication process for a semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jun 17, 2008·12 cites·3 claims
- 1787US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 1887US7642652B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jan 5, 2010·9 cites·21 claims
- 1987US7042095B2Semiconductor device including an interconnect having copper as a main componentRENESAS TECH CORP·Filed 2003·Granted May 9, 2006·48 cites·9 claims
- 2086US8586447B2Semiconductor device and manufacturing method of the sameNOGUCHI JUNJI·Filed 2012·Granted Nov 19, 2013·6 cites·2 claims
- 2186US8384220B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2008·Granted Feb 26, 2013·10 cites·6 claims
- 2286US6730594B2Method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·59 cites·38 claims
- 2385US7232757B2Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jun 19, 2007·26 cites·20 claims
- 2485US7084063B2Fabrication method of semiconductor integrated circuit deviceHITACHI LTD·Filed 2003·Granted Aug 1, 2006·31 cites·12 claims
- 2585US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 2684US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 2784US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 2883US6730590B2Semiconductor integrated circuit device and fabrication process thereofRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·23 cites·32 claims
- 2982US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 3082US6403459B1Fabrication process of semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Jun 11, 2002·22 cites·36 claims
- 3181US6716749B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·14 cites·6 claims
- 3280US7053487B2Semiconductor deviceRENESASTECHNOLOGY CORP·Filed 2002·Granted May 30, 2006·24 cites·37 claims
- 3380US6861756B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Mar 1, 2005·20 cites·21 claims
- 3478US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 3577US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 3677US6864169B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·12 cites·14 claims
- 3775US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 3875US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3974US6982200B2Semiconductor device manufacturing methodRENESAS TECH CORP·Filed 2003·Granted Jan 3, 2006·21 cites·10 claims
- 4074US6849535B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·3 claims
- 4173US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 4273US6797609B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·9 cites·10 claims
- 4372US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 4472US6756679B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Jun 29, 2004·8 cites·10 claims
- 4571US7321171B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jan 22, 2008·10 cites·18 claims
- 4671US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 4770US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 4870US8122405B2Delay adjusting method and LSI that uses air-gap wiringMATSUMOTO TAKASHI·Filed 2008·Granted Feb 21, 2012·4 cites·28 claims
- 4968US7419916B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·2 cites·8 claims
- 5066US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →