Inventor · disambiguated record
Justin Oberst
Also filed as: OBERST JUSTIN
5 granted patents·4 pending applications·6 citations·filing 2017–2021
64Inventor score
Files withLAM RES CORP9
Top patents by PatentIndex Score
9 records- 0188US11001934B2Methods and apparatus for flow isolation and focusing during electroplatingLAM RES CORP·Filed 2018·Granted May 11, 2021·6 cites·20 claims
- 0249US12247310B2Lipseal edge exclusion engineering to maintain material integrity at wafer edgeLAM RES CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 0348US12424453B2Low temperature direct copper-copper bondingLAM RES CORP·Filed 2019·Granted Sep 23, 2025·0 cites·25 claims
- 0447US2024312778A1Temporary capping material for oxide prevention in low temperature direct metal-metal bondingLAM RES CORP·Filed 2021·Application pending·0 cites
- 0547US2023212773A1Surface pretreatment for electroplating nanotwinned copperLAM RES CORP·Filed 2021·Application pending·0 cites
- 0645US11450631B2Alternative integration for redistribution layer processLAM RES CORP·Filed 2019·Granted Sep 20, 2022·0 cites·9 claims
- 0745US2020035484A1System and method for chemical and heated wetting of substrates prior to metal platingLAM RES CORP·Filed 2018·Application pending·0 cites
- 0842US2022010446A1Electrodeposition of nanotwinned copper structuresLAM RES CORP·Filed 2019·Application pending·0 cites
- 0938US10714436B2Systems and methods for achieving uniformity across a redistribution layerLAM RES CORP·Filed 2017·Granted Jul 14, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →