Inventor · disambiguated record
Junji Oh
Also filed as: OH JUNJI
16 granted patents·3 pending applications·163 citations·filing 2003–2024
91Inventor score
Top patents by PatentIndex Score
19 records- 0198US9620512B1Field effect transistor with a multilevel gate electrode for integration with a multilevel memory deviceSANDISK TECHNOLOGIES INC·Filed 2015·Granted Apr 11, 2017·64 cites·14 claims
- 0296US10141331B1Three-dimensional memory device containing support pillars underneath a retro-stepped dielectric material and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Nov 27, 2018·53 cites·22 claims
- 0394US11101284B2Three-dimensional memory device containing etch stop structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Aug 24, 2021·13 cites·20 claims
- 0493US11778818B2Three-dimensional memory device with punch-through-resistant word lines and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Oct 3, 2023·3 cites·7 claims
- 0593US8294217B2Semiconductor device and method of manufacturing semiconductor deviceEMA TAIJI·Filed 2011·Granted Oct 23, 2012·15 cites·15 claims
- 0676US8778786B1Method for substrate preservation during transistor fabricationSCUDDER LANCE·Filed 2012·Granted Jul 15, 2014·4 cites·19 claims
- 0776US7947567B2Method of fabricating a semiconductor device with reduced oxide film variationFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted May 24, 2011·5 cites·11 claims
- 0868US8476124B2Method of manufacturing semiconductor deviceOH JUNJI·Filed 2011·Granted Jul 2, 2013·3 cites·14 claims
- 0968US7294577B2Method of manufacturing a silicide layerFUJITSU LTD·Filed 2005·Granted Nov 13, 2007·3 cites·19 claims
- 1060US2025380414A1Three-dimensional memory containing etch-stop isolation caps over lateral isolation structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1157US9105743B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Aug 11, 2015·0 cites·9 claims
- 1257US2024243061A1Bonded three-dimensional memory device having temporary electrical grounding paths in dummy block and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1354US8766369B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Granted Jul 1, 2014·0 cites·18 claims
- 1454US8043917B2Method for manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Oct 25, 2011·0 cites·12 claims
- 1547US8273630B2Method for manufacturing semiconductor deviceWADA TAKAYUKI·Filed 2011·Granted Sep 25, 2012·0 cites·15 claims
- 1644US9117675B2Semiconductor device production methodFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Aug 25, 2015·0 cites·5 claims
- 1741US8592278B2Method of manufacturing semiconductor deviceFUJITA KAZUSHI·Filed 2011·Granted Nov 26, 2013·0 cites·6 claims
- 1840US2007093068A1Manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1937US7030026B2Semiconductor device fabrication methodFUJITSU LTD·Filed 2003·Granted Apr 18, 2006·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →