Inventor · disambiguated record
Jumyong Park
Also filed as: PARK JUMYONG
21 granted patents·20 pending applications·19 citations·filing 2013–2025
90Inventor score
Top patents by PatentIndex Score
41 records- 0193US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0290US9070748B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 30, 2015·10 cites·14 claims
- 0389US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0486US12512427B2Semiconductor device including lower pads having different widths and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·19 claims
- 0583US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0681US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0781US11798872B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
- 0875US9502274B2Wafer loaders having buffer zonesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·3 cites·6 claims
- 0974US2025105181A1Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1073US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1173US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1272US2024321794A1Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1371US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1471US2024290702A1Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1571US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1670US12347760B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 1768US12027482B2Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 1867US12199056B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1964US11637058B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 2063US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 2163US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 2263US11923309B2Semiconductor package including fine redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 2362US12009288B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 2459US12417990B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2559US11854893B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2659US2025125290A1Device for semiconductor package comprising connecting strucure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2759US2024234103A1Ring assembly and semiconductor wafer etching deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2858US2025029941A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2957US12224256B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 3057US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 3157US2024347510A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3256US2024237349A1Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3356US2024105679A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3455US2024178202A1Semiconductor devices including bonded semiconductor layers and manufacturing methods of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3555US2024128239A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3655US2024162104A1Semiconductor device, semiconductor package, and semiconductor chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3755US2023420397A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3854US2024105680A1Semiconductor chip stack structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3954US2024145366A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4049US2023089399A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4144US2015243637A1Semiconductor devices having through-vias and methods for fabricating the sameKANG PIL-KYU·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →