Inventor · disambiguated record
Juergen Schredl
Also filed as: SCHREDL JUERGEN
24 granted patents·2 pending applications·99 citations·filing 2005–2015
94Inventor score
Files withINFINEON TECHNOLOGIES AG11INFINEON TECHNOLOGIES AUSTRIA6OTREMBA RALF6INFINEON TECHNOLOGIES AUSTRIA AG2POH YONG CHERN1
Top patents by PatentIndex Score
26 records- 0197US8698293B2Multi-chip package and method of manufacturing thereofOTREMBA RALF·Filed 2012·Granted Apr 15, 2014·40 cites·30 claims
- 0281US8975117B2Semiconductor device using diffusion solderingOTREMBA RALF·Filed 2012·Granted Mar 10, 2015·7 cites·15 claims
- 0378US9147631B2Semiconductor power device having a heat sinkINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 29, 2015·4 cites·18 claims
- 0477US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 0574US7629676B2Semiconductor component having a semiconductor die and a leadframeINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·6 cites·14 claims
- 0672US8643176B2Power semiconductor chip having two metal layers on one faceOTREMBA RALF·Filed 2011·Granted Feb 4, 2014·3 cites·24 claims
- 0770US8896106B2Semiconductor packages having multiple lead frames and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 0870US7923827B2Semiconductor module for a switched-mode power supply and method for its assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 12, 2011·6 cites·23 claims
- 0970USD609191SPackage for electronic deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Feb 2, 2010·17 cites·1 claims
- 1069US9184066B2Chip arrangements and methods for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 10, 2015·2 cites·33 claims
- 1167US9099441B2Power transistor arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·2 cites·15 claims
- 1266US9230880B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 5, 2016·1 cites·20 claims
- 1363US9362240B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 1462US9147628B2Package-in-packages and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Sep 29, 2015·1 cites·17 claims
- 1562US8853849B2Package arrangement and a method of manufacturing a package arrangementINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 7, 2014·1 cites·15 claims
- 1661US9263440B2Power transistor arrangement and package having the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·1 cites·18 claims
- 1758US7821141B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 26, 2010·1 cites·29 claims
- 1856US9449902B2Semiconductor packages having multiple lead frames and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·27 claims
- 1950US9117786B2Chip module, an insulation material and a method for fabricating a chip moduleINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 25, 2015·0 cites·17 claims
- 2049US9412626B2Method for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 9, 2016·0 cites·18 claims
- 2148US9824958B2Chip carrier structure, chip package and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Nov 21, 2017·0 cites·17 claims
- 2246US9786584B2Lateral element isolation deviceOTREMBA RALF·Filed 2012·Granted Oct 10, 2017·0 cites·25 claims
- 2346US9627292B2Semiconductor housing with rear-side structuringINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·0 cites·22 claims
- 2443US2014306331A1Chip and chip arrangementINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 2537US9991183B2Semiconductor component having inner and outer semiconductor component housingsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Jun 5, 2018·0 cites·20 claims
- 2637US2013154123A1Semiconductor Device and Fabrication MethodPOH YONG CHERN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →