Inventor · disambiguated record
Jürgen Schredl
Also filed as: SCHREDL JUERGEN · SCHREDL JüRGEN
7 granted patents·3 pending applications·9 citations·filing 1997–2025
76Inventor score
Files withINFINEON TECHNOLOGIES AG5INFINEON TECHNOLOGIES AUSTRIA2PAC TECH GMBH2INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
10 records- 0184US11355460B1Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·2 cites·21 claims
- 0267US9196554B2Electronic component, arrangement and methodINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 24, 2015·2 cites·18 claims
- 0367US9196577B2Semiconductor packaging arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 0463US11817407B2Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 14, 2023·0 cites·21 claims
- 0550US2024030148A1Semiconductor devices and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0649US10109609B2Connection structure and electronic componentINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Oct 23, 2018·0 cites·25 claims
- 0744US2025226353A1Semiconductor package suitable for high voltage applications and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0843US9099391B2Semiconductor package with top-side insulation layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·0 cites·7 claims
- 0932US6328200B1Process for selective solderingPAC TECH GMBH·Filed 1997·Granted Dec 11, 2001·3 cites·14 claims
- 1027US2002040923A1Contact structure for connecting two substrates and also process for producing such a contact structurePAC TECH GMBH·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jürgen Schredl files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →