Inventor · disambiguated record
Jung-Woo Seo
Also filed as: SEO JUNG W · SEO JUNG WOO · SEO JUNG-WOO T · SEO JUNG-WOO TED
49 granted patents·20 pending applications·232 citations·filing 2001–2025
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25UNIV NORTHWESTERN5CORENTEC CO LTD4HANWHA SOLUTIONS CORP3SAMSUNG ELECTRO MECH3
Top patents by PatentIndex Score
69 records- 0194US9221064B2Sorting two-dimensional nanomaterials by thicknessUNIV NORTHWESTERN·Filed 2014·Granted Dec 29, 2015·10 cites·15 claims
- 0294US8485208B2Canopy tentSEO JUNG WOO·Filed 2009·Granted Jul 16, 2013·43 cites·5 claims
- 0392US9159560B2Methods of forming hole patterns of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·13 cites·20 claims
- 0492US8865107B2Highly concentrated nano-reinforcement suspensions for cementitious materials and method of reinforcing such materialsHERSAM MARK C·Filed 2011·Granted Oct 21, 2014·16 cites·9 claims
- 0592US7053435B2Electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·57 cites·5 claims
- 0688US11622445B2Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the sameILJIN MAT CO LTD·Filed 2020·Granted Apr 4, 2023·2 cites·9 claims
- 0788US9490256B2Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes and method of manufacturing the sameKIM JUN-KYUM·Filed 2015·Granted Nov 8, 2016·7 cites·15 claims
- 0884US10573653B2Semiconductor devices having contact plugs overlapping associated bitline structures and contact holesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 25, 2020·2 cites·20 claims
- 0984US7511328B2Semiconductor device having raised cell landing pad and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 31, 2009·13 cites·9 claims
- 1084US7495022B2α,β-unsaturated hydroxamic acid derivatives and their use as histone deacetylase inhibitorsSK CHEMICALS CO LTD·Filed 2003·Granted Feb 24, 2009·14 cites·4 claims
- 1184US7314795B2Methods of forming electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 1, 2008·8 cites·39 claims
- 1280US9786672B2Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 10, 2017·2 cites·12 claims
- 1379US12183574B2Two-dimensional semiconductor based printable optoelectronic inks, fabricating methods and applications of sameUNIV NORTHWESTERN·Filed 2023·Granted Dec 31, 2024·0 cites·9 claims
- 1479US7851354B2Semiconductor memory device having local etch stopper and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 14, 2010·6 cites·13 claims
- 1578US7919127B2Pulsatilla spp. extracts effective in brain functionSK CHEMICALS CO LTD·Filed 2005·Granted Apr 5, 2011·2 cites·13 claims
- 1677US8424487B2Roll-to-roll patterning apparatus and patterning system having the sameCHO YOUNG TAE·Filed 2010·Granted Apr 23, 2013·2 cites·20 claims
- 1777US2025355133A1Apparatus and method of predicting photovoltaic power generation amountHANWHA SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 1874US11437723B2Antenna apparatusSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 6, 2022·2 cites·19 claims
- 1974US9324609B2Methods of manufacturing semiconductor devices having high aspect ratioSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 26, 2016·2 cites·20 claims
- 2073US7098018B2Aminopeptidase derived from bacillus licheniformis, gene encoding the aminopeptidase, expression vector containing the gene, transformant and method for preparation thereofLG LIFE SCIENCES LTD·Filed 2002·Granted Aug 29, 2006·3 cites·8 claims
- 2171US7648875B2Methods for forming DRAM devices including protective patterns and related devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 19, 2010·6 cites·6 claims
- 2271US7462899B2Semiconductor memory device having local etch stopper and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 9, 2008·5 cites·14 claims
- 2370US10700074B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 30, 2020·0 cites·30 claims
- 2470US8557130B2Nano-imprint lithography methodsCHO YOUNG TAE·Filed 2009·Granted Oct 15, 2013·4 cites·9 claims
- 2567US9177960B2Method of forming semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·2 cites·20 claims
- 2666US11855355B2Antenna apparatusSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 26, 2023·0 cites·15 claims
- 2766US8596509B2High speed and fine substrate alignment apparatus in roll to roll systemKIM DONG MIN·Filed 2009·Granted Dec 3, 2013·3 cites·12 claims
- 2863US11830735B2Two-dimensional semiconductor based printable optoelectronic inks, fabricating methods and applications of sameUNIV NORTHWESTERN·Filed 2019·Granted Nov 28, 2023·0 cites·12 claims
- 2962US7682778B2Methods of forming contact plugs in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·1 cites·11 claims
- 3062US2025363514A1Device and method for calculating power market price based on photovoltaic power generationHANWHA SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 3162US2025329816A1Battery coolingGM GLOBAL TECH OPERATIONS LLC·Filed 2024·Application pending·0 cites
- 3261US10893946B2Asymmetric artificial knee jointCORENTEC CO LTD·Filed 2016·Granted Jan 19, 2021·1 cites·14 claims
- 3361US10446558B2Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·20 claims
- 3461US7888725B2Electronic devices including electrode walls with insulating layers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·1 cites·17 claims
- 3558US11245201B2Antenna apparatusSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 8, 2022·0 cites·19 claims
- 3658US10177155B2Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 3757US2025087801A1Mechanically connected cell-to-cell energy storage arrayGM GLOBAL TECH OPERATIONS LLC·Filed 2023·Application pending·0 cites
- 3855US12202986B2Two-dimensional insulator based printable ion-conductive and viscosity-tunable inks, fabricating methods and applications of sameUNIV NORTHWESTERN·Filed 2020·Granted Jan 21, 2025·0 cites·10 claims
- 3955US11351976B2Motor torque control method for motor-driven vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·9 claims
- 4055US2025363555A1Apparatus and method for formulating bidding strategy based on photovoltatic power generationHANWHA SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 4153US12144124B2Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring boardLOTTE ENERGY MAT CORPORATION·Filed 2022·Granted Nov 12, 2024·0 cites·10 claims
- 4252US7491601B2Methods of forming electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·22 claims
- 4352US2008064206A1Method of manufacturing a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4451US6563098B2High-precision displacement measurement device and method using unit displacement sensor based on confocal theoryKOREA ADVANCED INST OF TECHNOL·Filed 2001·Granted May 13, 2003·5 cites·6 claims
- 4551US2025365863A1Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the sameLOTTE ENERGY MAT CORPORATION·Filed 2022·Application pending·0 cites
- 4649US9266735B2Separation of single-walled carbon nanotubes by self-forming density gradient ultracentrifugationHERSAM MARK C·Filed 2012·Granted Feb 23, 2016·0 cites·31 claims
- 4749US7312121B2Method of manufacturing a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 25, 2007·0 cites·10 claims
- 4849US7208705B2Heater bracket assembly for dryerLG ELECTRONICS INC·Filed 2004·Granted Apr 24, 2007·0 cites·20 claims
- 4948US2022399547A1Surface-treated copper foil, method for producing same, and negative electrode for secondary battery including sameILJIN MAT CO LTD·Filed 2019·Application pending·0 cites
- 5047US2014248214A1High-concentration aqueous dispersions of graphene using nonionic, biocompatible copolymersUNIV NORTHWESTERN·Filed 2013·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →