Inventor · disambiguated record
Jun Wang
Also filed as: WANG JUN · WANG JUN-LIN
65 granted patents·39 pending applications·456 citations·filing 1997–2025
98Inventor score
Files withACM RESEARCH SHANGHAI INC24A123 SYSTEMS LLC13MOTOROLA INC8CHINA NATIONAL ELECTRIC APPARATUS RES INSTITUTE CO LTD5SHENZHEN MINDRAY BIOMEDICAL ELECTRONICS CO LTD5
Top patents by PatentIndex Score
104 records- 0194US6291319B1Method for fabricating a semiconductor structure having a stable crystalline interface with siliconMOTOROLA INC·Filed 1999·Granted Sep 18, 2001·148 cites·40 claims
- 0290US11581205B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Feb 14, 2023·2 cites·42 claims
- 0390US9343321B2Chemical mechanical planarization using nanodiamondSAINT GOBAIN CERAMICS·Filed 2015·Granted May 17, 2016·6 cites·20 claims
- 0488US7005717B2Semiconductor device and methodFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Feb 28, 2006·41 cites·20 claims
- 0586US11141762B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 12, 2021·3 cites·42 claims
- 0686US9120200B2Polishing slurry including zirconia particles and a method of using the polishing slurryHAERLE ANDREW G·Filed 2011·Granted Sep 1, 2015·10 cites·16 claims
- 0786US6241821B1Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 1999·Granted Jun 5, 2001·45 cites·22 claims
- 0886US6022410AAlkaline-earth metal silicides on siliconMOTOROLA INC·Filed 1998·Granted Feb 8, 2000·53 cites·22 claims
- 0985US6224669B1Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 2000·Granted May 1, 2001·35 cites·36 claims
- 1084USD1034582STablet computerSHENZHEN PEICHENG TECH CO LTD·Filed 2022·Granted Jul 9, 2024·10 cites·1 claims
- 1183US6248459B1Semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 1999·Granted Jun 19, 2001·42 cites·36 claims
- 1283US2025357473A1Methods and systems for cathode pre-lithiation layerA123 SYSTEMS LLC·Filed 2025·Application pending·0 cites
- 1382US10640862B2Method for forming film and method for forming aluminum nitride filmBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2016·Granted May 5, 2020·2 cites·18 claims
- 1482US8980113B2Chemical mechanical planarization using nanodiamondWANG JUN·Filed 2010·Granted Mar 17, 2015·5 cites·17 claims
- 1582US2025309256A1Method and systems for coated cathode materials and use of coated cathode materialsA123 SYSTEMS LLC·Filed 2025·Application pending·0 cites
- 1681US12362354B2Method and systems for coated cathode materials and use of coated cathode materialsA123 SYSTEMS LLC·Filed 2019·Granted Jul 15, 2025·1 cites·20 claims
- 1781US11911808B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2023·Granted Feb 27, 2024·0 cites·40 claims
- 1880US2024429365A1Cathode with pre-lithiation coating and methods for preparation and useA123 SYSTEMS LLC·Filed 2024·Application pending·0 cites
- 1978US11037804B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Jun 15, 2021·2 cites·33 claims
- 2077US11257667B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Feb 22, 2022·2 cites·27 claims
- 2177US7993420B2Ceria material and method of forming sameSAINT GOBAIN CERAMICS·Filed 2009·Granted Aug 9, 2011·4 cites·11 claims
- 2275US11633765B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 2375US2025300524A1Rotor balancing device for large massABB SCHWEIZ AG·Filed 2025·Application pending·0 cites
- 2474US12158476B2Automatic analysis apparatus and operating method thereforSHENZHEN MINDRAY BIOMEDICAL ELECTRONICS CO LTD·Filed 2020·Granted Dec 3, 2024·1 cites·23 claims
- 2574US10910244B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 2, 2021·2 cites·35 claims
- 2673US12494360B2Apparatus and method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2024·Granted Dec 9, 2025·0 cites·19 claims
- 2772US10643843B2Film forming method and aluminum nitride film forming method for semiconductor apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 2872US2025285882A1Method and apparatus for removing particles or photoresist on substratesACM RESEARCH SHANGHAI INC·Filed 2025·Application pending·0 cites
- 2971US8685123B2Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate materialWANG JUN·Filed 2005·Granted Apr 1, 2014·3 cites·22 claims
- 3070US11967497B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 3170US2022359862A1Methods and systems for cathode pre-lithiation layerA123 SYSTEMS LLC·Filed 2022·Application pending·0 cites
- 3269US12418019B2Cathode with pre-lithiation coating and methods for preparation and useA123 SYSTEMS LLC·Filed 2019·Granted Sep 16, 2025·0 cites·15 claims
- 3369US11728186B2Device for conveying and dispersing silicon wafersHANGZHOU ZHONGWEI PHOTOELECTRIC TECH CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·10 claims
- 3469US7384574B2Hydrogen storage material and process using graphite additive with metal-doped complex hydridesWESTINGHOUSE SAVANNAH RIVER CO·Filed 2004·Granted Jun 10, 2008·10 cites·6 claims
- 3568US11749538B2Device for degumming and inserting silicon wafers and method for processing silicon wafersHANGZHOU ZHONGWEI PHOTOELECTRIC TECH CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·16 claims
- 3667US12374566B2Turnaround mechanism of silicon wafersHANGZHOU ZHONGWEI PHOTOELECTRIC TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·10 claims
- 3767US8216328B2Ceria material and method of forming sameHAERLE ANDREW G·Filed 2011·Granted Jul 10, 2012·1 cites·8 claims
- 3866US10732191B2Automatic analysis device, analysis method, and analysis system thereforSHENZHEN MINDRAY BIOMEDICAL ELECTRONICS CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·18 claims
- 3965US9410063B2Polishing slurry including zirconia particles and a method of using the polishing slurrySAINT-GOBAIN CERAM & PLASTICS INC·Filed 2015·Granted Aug 9, 2016·1 cites·11 claims
- 4064US11848217B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted Dec 19, 2023·0 cites·37 claims
- 4164US11638937B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted May 2, 2023·0 cites·52 claims
- 4263US11945065B2Multi-axis turntableKEDE NUMERICAL CONTROL CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·6 claims
- 4363US2020259164A1Pre-lithiated silicon anodes with pvdf binderA123 SYSTEMS LLC·Filed 2020·Application pending·0 cites
- 4462US10739495B2Cloud water resource detecting system and methodUNIV XIAN TECHNOLOGY·Filed 2018·Granted Aug 11, 2020·1 cites·14 claims
- 4562US2025314578A1Natural environment accelerated corrosion test device and method for air conditionersCHINA NATIONAL ELECTRIC APPARATUS RES INSTITUTE CO LTD·Filed 2025·Application pending·0 cites
- 4661US11682758B2Process for metallization of electrochemically active powdersA123 SYSTEMS LLC·Filed 2018·Granted Jun 20, 2023·0 cites·41 claims
- 4761US2025109495A1Furnace tube for thin film deposition, thin film deposition method and processing apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 4861US2024218551A1Electroplating apparatus and electroplating method for non-circular substrateACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 4960US12148914B2Electrochemically active dispersions and composites for rechargeable battery anodesNOVONIX BATTERY TECH SOLUTIONS INC·Filed 2019·Granted Nov 19, 2024·0 cites·33 claims
- 5060US11752529B2Method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Sep 12, 2023·0 cites·23 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →