Electroplating apparatus and electroplating method for non-circular substrate

Abstract

The present invention disclosed an electroplating apparatus for non-circular substrate, comprising a central electrode area, a peripheral electrode area, a power supply unit and a control device. The size of the central electrode area is the inscribed circle of the non-circular substrate, and the central electrode is arranged in the central electrode area. The peripheral electrode area surrounds the central electrode area. The peripheral size of the peripheral electrode area is the circumscribed circle of the non-circular substrate. The peripheral electrode area is provided with closely arranged point electrodes, and the point electrodes fill the peripheral electrode area. The power supply unit supply power to the central electrode and the point electrodes. The control device is connected between the power supply unit, the central electrode and the point electrodes and controls the on-off of the central electrode and the point electrodes. The control device tracks the rotating position of the substrate, so that the electrodes in the central electrode area and the peripheral electrode area covered by the substrate will be turned on and the electrodes not covered by the substrate will be turned off. The present invention also disclosed an electroplating method for the non-circular substrate.

What is claimed is: 
     
         1 . An electroplating apparatus for non-circular substrate, comprising:
 A circular central electrode area configured with a central electrode filling the entire center electrode area which size is an inscribed circle of the non-circular substrate;   A peripheral electrode area configured with a close arrangement of point electrodes filling the peripheral electrode area which peripheral size is the circumscribed circle of the non-circular substrate surrounding the central electrode area;   A power supply unit being connected to the central electrode and the point electrodes to supply power to the central electrode and the point electrodes; and   A control device being connected between the power supply unit, the central electrode and the point electrodes for controlling the on-off of the central electrode and the point electrodes, wherein the control device tracks the rotating position of the substrate so that the electrodes in the central electrode area and the peripheral electrode area covered by the substrate will be turned on and the electrodes not covered by the substrate will be turned off.   
     
     
         2 . An electroplating apparatus for non-circular substrate as claimed in  claim 1 , wherein the central electrode is always covered by the substrate, the point electrodes in the peripheral electrode area covered by the substrate being determined as follows:
 Determining the position of each vertex angle of the non-circular substrate relative to the center of the circle;   Determining the opening angle of each vertex angle according to the two sides that make up the vertex angle;   Detecting the rotating position of the substrate, determining the position of each vertex angle of the substrate according to the rotating position of the substrate, wherein the vertex angles are located on the outer circumference of the peripheral electrode area;   Taking each vertex angle as the origin, determining the projection area in the peripheral electrode area according to the opening angle of each vertex angle, the point electrodes falling in the projection area being the point electrodes covered by the substrate.   
     
     
         3 . An electroplating apparatus for non-circular substrate as claimed in  claim 2 , wherein the controlling device includes:
 An angle sensor configured to track the rotation angle of the substrate;   A projection simulator configured to determine the position of each vertex angle according to the rotation angle of the substrate and determine the projection area according to the opening angle of each vertex angle;   A switching device connected between the point electrodes in the peripheral area and the power supply unit configured to turn on the point electrodes currently in the projection area and turn off the point electrodes currently not in the projection area.   
     
     
         4 . An electroplating apparatus for non-circular substrate as claimed in  claim 1 , wherein the central electrode is:
 A single circular electrode filling the central electrode area; or   Several block electrodes combined to form a circle and filling the central electrode area; or   Several ring electrodes combined to form a circle and filling the central electrode area.   
     
     
         5 . An electroplating apparatus for non-circular substrate as claimed in  claim 4 , wherein there are several concentric-ring shape peripheral electrode areas starting from the central electrode area and circling outward in turn, the outermost peripheral electrode area size of which is the circumscribed circle of the non-circular substrate. 
     
     
         6 . An electroplating apparatus for non-circular substrate as claimed in  claim 5 , wherein the power supply unit comprises a central power supply supplies power to the central electrode and several peripheral power supplies supply power to the point electrodes in the corresponding peripheral electrode area respectively, each peripheral electrode area configured with its own peripheral power supply and switching device. 
     
     
         7 . An electroplating apparatus for non-circular substrate as claimed in  claim 5 , wherein the power supply unit comprises a central power supply supplies power to the central electrode and a peripheral power supply supplies power to the point electrodes in all peripheral electrode areas, each peripheral electrode area configured with its own peripheral power supply and sharing the same switching device. 
     
     
         8 . An electroplating apparatus for non-circular substrate as claimed in  claim 5 , wherein the power supply unit supplies power to the central electrode and the point electrodes in all peripheral electrode areas, each peripheral electrode area configured with its own switching device, all peripheral electrode areas and the central electrode sharing the same power supply unit. 
     
     
         9 . An electroplating apparatus for non-circular substrate as claimed in  claim 5 , wherein three peripheral electrode areas are arranged sequentially around the central electrode area, the shape of the point electrode configured to circular, square, hexagonal or arc-shaped. 
     
     
         10 . An electroplating apparatus for non-circular substrate as claimed in  claim 9 , wherein the non-circular substrate is:
 a square substrate which four vertex angles are located on the outer circumference of the outermost peripheral electrode area that the opening angle of each vertex angle is 90 degrees and the opening angle of each vertex angle is symmetrical to the diameter of circle; or   a rectangle substrate four vertex angles are located on the outer circumference of the outermost peripheral electrode area that the opening angle of each vertex angle is 90 degrees and the opening angle of each vertex angle is asymmetrical to the diameter of circle.   
     
     
         11 . An electroplating method for non-circular substrate, including:
 Dividing the electrode area into a circular central electrode area configured with a central electrode filling the central electrode area which size is the inscribed circle of the non-circular substrate and a peripheral electrode area configured with a close arrangement of point electrodes filling the peripheral electrode area which peripheral size is the circumscribed circle of the non-circular substrate surrounding the central electrode area.   Tracking the rotation of the substrate and tracking the rotating position of the substrate.   Controlling the on-off of the electrodes, the power supply unit connected to the central electrode and the point electrodes through the control device configured to control the on-off of the central electrode and the point electrodes to supply power to the central electrode and the point electrodes, wherein the control device turns on the electrodes in the area covered by the substrate and turns off the electrodes in the area not covered by the substrate in the central electrode area and the peripheral electrode area according to the rotating position of the substrate so that the electrodes are turned on or off following the rotation of the substrate.   
     
     
         12 . An electroplating method for non-circular substrate as claimed in  claim 11 , wherein the central electrode is always covered by the substrate, the point electrodes in the peripheral electrode area covered by the substrate being determined as follows:
 Determining the position of each vertex angle of the non-circular substrate relative to the center of the circle;   Determining the opening angle of each vertex angle according to the two sides that make up the vertex angle;   Detecting the rotating position of the substrate, determining the position of each vertex angle of the substrate according to the rotating position of the substrate, wherein the vertex angles are located on the outer circumference of the peripheral electrode area;   Taking each vertex angle as the origin, determining the projection area in the peripheral electrode area according to the opening angle of each vertex angle, the point electrodes falling in the projection area being the point electrodes covered by the substrate.   
     
     
         13 . An electroplating method for non-circular substrate as claimed in  claim 12 , wherein the controlling device configured as following:
 Tracking the rotation angle of the substrate through an angle sensor;   Determining the position of each vertex angle according to the rotation angle of the substrate through a projection simulator and determining the projection area according to the opening angle of each vertex angle;   Controlling the on-off of the point electrodes that turn on the point electrodes currently in the projection area and turn off the point electrodes currently not in the projection area through a switching device connected between the point electrodes in the peripheral area and the power supply unit.   
     
     
         14 . An electroplating method for non-circular substrate as claimed in  claim 11 , wherein the central electrode is:
 A single circular electrode filling the central electrode area; or   Several block electrodes combined to form a circle and filling the central electrode area; or   Several ring electrodes combined to form a circle and filling the central electrode area.   
     
     
         15 . An electroplating method for non-circular substrate as claimed in  claim 11 , wherein there are several concentric-ring shape peripheral electrode areas starting from the central electrode area and circling outward in turn, the outermost peripheral electrode area size of which is the circumscribed circle of the non-circular substrate. 
     
     
         16 . An electroplating method for non-circular substrate as claimed in  claim 15 , wherein the power supply unit comprises a central power supply supplies power to the central electrode and several peripheral power supplies supply power to the point electrodes in the corresponding peripheral electrode area respectively, each peripheral electrode area configured with its own peripheral power supply and switching device. 
     
     
         17 . An electroplating method for non-circular substrate as claimed in  claim 15 , wherein the power supply unit comprises a central power supply supplies power to the central electrode and a peripheral power supply supplies power to the point electrodes in all peripheral electrode areas, each peripheral electrode area configured with its own peripheral power supply and sharing the same switching device. 
     
     
         18 . An electroplating method for non-circular substrate as claimed in  claim 15 , wherein the power supply unit supplies power to the central electrode and the point electrodes in all peripheral electrode areas, each peripheral electrode area configured with its own switching device, all peripheral electrode areas and the central electrode sharing the same power supply unit. 
     
     
         19 . An electroplating method for non-circular substrate as claimed in  claim 15 , wherein three peripheral electrode areas are arranged sequentially around the central electrode area, the shape of the point electrode configured to circular, square, hexagonal or arc-shaped. 
     
     
         20 . An electroplating method for non-circular substrate as claimed in  claim 19 , wherein the non-circular substrate is:
 a square substrate which four vertex angles are located on the outer circumference of the outermost peripheral electrode area that the opening angle of each vertex angle is 90 degrees and the opening angle of each vertex angle is symmetrical to the diameter of circle; or   a rectangle substrate four vertex angles are located on the outer circumference of the outermost peripheral electrode area that the opening angle of each vertex angle is 90 degrees and the opening angle of each vertex angle is asymmetrical to the diameter of circle.