Assignee
ACM RESEARCH SHANGHAI INC
CN·62 granted patents·39 pending applications·29 citations·filing 2007–2025
Top patents by PatentIndex Score
101 records- 0190US11581205B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Feb 14, 2023·2 cites·42 claims
- 0289US2026062829A1Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2025·Application pending·0 cites
- 0386US11141762B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 12, 2021·3 cites·42 claims
- 0482US10297472B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2012·Granted May 21, 2019·5 cites·29 claims
- 0581US11911808B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2023·Granted Feb 27, 2024·0 cites·40 claims
- 0679US9496172B2Method for forming interconnection structuresACM RESEARCH SHANGHAI INC·Filed 2012·Granted Nov 15, 2016·4 cites·14 claims
- 0778US11629425B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 18, 2023·0 cites·19 claims
- 0878US11037804B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Jun 15, 2021·2 cites·33 claims
- 0977US12186684B2Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic deviceACM RESEARCH SHANGHAI INC·Filed 2024·Granted Jan 7, 2025·0 cites·13 claims
- 1077US11257667B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Feb 22, 2022·2 cites·27 claims
- 1176US12467156B2Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2023·Granted Nov 11, 2025·0 cites·10 claims
- 1276US10907266B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2018·Granted Feb 2, 2021·0 cites·14 claims
- 1375US11633765B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 1474US10910244B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 2, 2021·2 cites·35 claims
- 1573US12494360B2Apparatus and method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2024·Granted Dec 9, 2025·0 cites·19 claims
- 1672US2024183051A1Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2024·Application pending·0 cites
- 1772US2025285882A1Method and apparatus for removing particles or photoresist on substratesACM RESEARCH SHANGHAI INC·Filed 2025·Application pending·0 cites
- 1870US11967497B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 1970US11469134B2Plating chuckACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 11, 2022·1 cites·20 claims
- 2069US10410906B2Substrate supporting apparatusACM RESEARCH SHANGHAI INC·Filed 2012·Granted Sep 10, 2019·3 cites·13 claims
- 2168US10141205B2Apparatus and method for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2014·Granted Nov 27, 2018·2 cites·10 claims
- 2268US10113244B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2013·Granted Oct 30, 2018·0 cites·23 claims
- 2367US11955328B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 2467US9633833B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Apr 25, 2017·1 cites·14 claims
- 2566US11925881B2Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic deviceACM RESEARCH SHANGHAI INC·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 2665US8671961B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2013·Granted Mar 18, 2014·1 cites·9 claims
- 2764US11848217B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted Dec 19, 2023·0 cites·37 claims
- 2864US11638937B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted May 2, 2023·0 cites·52 claims
- 2962US10453743B2Barrier layer removal method and semiconductor structure forming methodACM RESEARCH SHANGHAI INC·Filed 2014·Granted Oct 22, 2019·1 cites·6 claims
- 3062US2025059671A1Method for cleaning electroplating deviceACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3162US2025066945A1Liquid storage device and electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3261US12486590B2Substrate processing methodACM RESEARCH SHANGHAI INC·Filed 2022·Granted Dec 2, 2025·0 cites·9 claims
- 3361US2025109495A1Furnace tube for thin film deposition, thin film deposition method and processing apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3461US2024218551A1Electroplating apparatus and electroplating method for non-circular substrateACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3560US12111575B2Coater with automatic cleaning function and coater automatic cleaning methodACM RESEARCH SHANGHAI INC·Filed 2020·Granted Oct 8, 2024·0 cites·14 claims
- 3660US11752529B2Method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Sep 12, 2023·0 cites·23 claims
- 3759US2024368766A1Thin film deposition device, thin film deposition method and thin film deposition apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3859US2024279838A1Electroplating device and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3958US11462423B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2019·Granted Oct 4, 2022·0 cites·14 claims
- 4057US12573019B2Electroplating chamber leakage plating warning method and systemACM RESEARCH SHANGHAI INC·Filed 2022·Granted Mar 10, 2026·0 cites·9 claims
- 4157US12334367B2Method and apparatus for removing particles or photoresist on substratesACM RESEARCH SHANGHAI INC·Filed 2020·Granted Jun 17, 2025·0 cites·32 claims
- 4257US11926920B2Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2019·Granted Mar 12, 2024·0 cites·20 claims
- 4357US11781235B2Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2018·Granted Oct 10, 2023·0 cites·10 claims
- 4457US2017260641A1Apparatus and method for uniform metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2014·Application pending·0 cites
- 4556US2026090329A1Wafer centering adjustment apparatus and adjustment methodACM RESEARCH SHANGHAI INC·Filed 2023·Application pending·0 cites
- 4656US2024035189A1Cup-shaped chuck of substrate holding device and substrate holding deviceACM RESEARCH SHANGHAI INC·Filed 2021·Application pending·0 cites
- 4756US2025198039A1Electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2023·Application pending·0 cites
- 4855US11335550B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2017·Granted May 17, 2022·0 cites·32 claims
- 4955US10816901B2Coater with automatic cleaning function and coater automatic cleaning methodACM RESEARCH SHANGHAI INC·Filed 2014·Granted Oct 27, 2020·0 cites·11 claims
- 5054US12544807B2Wafer cleaning apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Granted Feb 10, 2026·0 cites·10 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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