Inventor · disambiguated record
Zhaowei Jia
Also filed as: JIA ZHAOWEI
26 granted patents·13 pending applications·29 citations·filing 2008–2024
93Inventor score
Top patents by PatentIndex Score
39 records- 0190US11581205B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Feb 14, 2023·2 cites·42 claims
- 0286US11141762B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 12, 2021·3 cites·42 claims
- 0383US8598039B2Barrier layer removal method and apparatusWANG JIAN·Filed 2008·Granted Dec 3, 2013·8 cites·12 claims
- 0481US11911808B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2023·Granted Feb 27, 2024·0 cites·40 claims
- 0579US9496172B2Method for forming interconnection structuresACM RESEARCH SHANGHAI INC·Filed 2012·Granted Nov 15, 2016·4 cites·14 claims
- 0678US11037804B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Jun 15, 2021·2 cites·33 claims
- 0777US11257667B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Feb 22, 2022·2 cites·27 claims
- 0875US11633765B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 0974US10910244B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 2, 2021·2 cites·35 claims
- 1072US2024183051A1Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2024·Application pending·0 cites
- 1170US11967497B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 1270US11469134B2Plating chuckACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 11, 2022·1 cites·20 claims
- 1367US9633833B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Apr 25, 2017·1 cites·14 claims
- 1464US11848217B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted Dec 19, 2023·0 cites·37 claims
- 1564US11638937B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted May 2, 2023·0 cites·52 claims
- 1664US9595457B2Methods and apparatus for cleaning semiconductor wafersWANG JIAN·Filed 2008·Granted Mar 14, 2017·2 cites·12 claims
- 1762US10453743B2Barrier layer removal method and semiconductor structure forming methodACM RESEARCH SHANGHAI INC·Filed 2014·Granted Oct 22, 2019·1 cites·6 claims
- 1862US2025059671A1Method for cleaning electroplating deviceACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 1962US2025066945A1Liquid storage device and electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 2061US12486590B2Substrate processing methodACM RESEARCH SHANGHAI INC·Filed 2022·Granted Dec 2, 2025·0 cites·9 claims
- 2161US2024218551A1Electroplating apparatus and electroplating method for non-circular substrateACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 2260US11752529B2Method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Sep 12, 2023·0 cites·23 claims
- 2360US9492852B2Methods and apparatus for cleaning semiconductor wafersWANG JIAN·Filed 2009·Granted Nov 15, 2016·1 cites·13 claims
- 2457US11926920B2Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2019·Granted Mar 12, 2024·0 cites·20 claims
- 2556US2024035189A1Cup-shaped chuck of substrate holding device and substrate holding deviceACM RESEARCH SHANGHAI INC·Filed 2021·Application pending·0 cites
- 2656US2025198039A1Electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2023·Application pending·0 cites
- 2752US2019393074A1Barrier layer removal method and semiconductor structure forming methodACM RESEARCH SHANGHAI INC·Filed 2019·Application pending·0 cites
- 2852US2025051954A1Electroplating deviceACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 2951US11103898B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Aug 31, 2021·0 cites·43 claims
- 3051US2024376627A1Electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 3150US2023374691A1Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2020·Application pending·0 cites
- 3250US2024026561A1Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2021·Application pending·0 cites
- 3350US2014053978A1Barrier Layer Removal Method and ApparatusACM RESEARCH SHANGHAI INC·Filed 2013·Application pending·0 cites
- 3448US10020208B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Jul 10, 2018·0 cites·17 claims
- 3547US2024044038A1Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2021·Application pending·0 cites
- 3645US11859303B2Plating apparatusACM RESEARCH SHANGHAI INC·Filed 2017·Granted Jan 2, 2024·0 cites·37 claims
- 3741US10615073B2Method for removing barrier layer for minimizing sidewall recessACM RESEARCH SHANGHAI INC·Filed 2015·Granted Apr 7, 2020·0 cites·13 claims
- 3839US10217662B2Method for processing interconnection structure for minimizing barrier sidewall recessACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 26, 2019·0 cites·14 claims
- 3936US11008669B2Apparatus for holding a substrateACM RESEARCH SHANGHAI INC·Filed 2015·Granted May 18, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →