Inventor · disambiguated record
Judy Wang
Also filed as: WANG JUDY
7 granted patents·3 pending applications·441 citations·filing 2000–2017
86Inventor score
Top patents by PatentIndex Score
10 records- 0197US6403491B1Etch method using a dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2000·Granted Jun 11, 2002·396 cites·24 claims
- 0285US8133819B2Plasma etching carbonaceous layers with sulfur-based etchantsWANG JUDY·Filed 2008·Granted Mar 13, 2012·16 cites·18 claims
- 0383US7432210B2Process to open carbon based hardmaskAPPLIED MATERIALS INC·Filed 2005·Granted Oct 7, 2008·9 cites·9 claims
- 0482US7807064B2Halogen-free amorphous carbon mask etch having high selectivity to photoresistAPPLIED MATERIALS INC·Filed 2007·Granted Oct 5, 2010·8 cites·17 claims
- 0577US7510976B2Dielectric plasma etch process with in-situ amorphous carbon mask with improved critical dimension and etch selectivityAPPLIED MATERIALS INC·Filed 2006·Granted Mar 31, 2009·6 cites·20 claims
- 0671US7838432B2Etch process with controlled critical dimension shrinkAPPLIED MATERIALS INC·Filed 2007·Granted Nov 23, 2010·5 cites·18 claims
- 0764US10570815B2Wastegate valve assembly with biasing membersHONEYWELL INT INC·Filed 2017·Granted Feb 25, 2020·1 cites·17 claims
- 0848US2008286977A1Process to open carbon based hardmask overlying a dielectric layerWANG JUDY·Filed 2008·Application pending·0 cites
- 0943US2009023294A1Method for etching using advanced patterning film in capacitive coupling high frequency plasma dielectric etch chamberAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1040US2008203056A1Methods for etching high aspect ratio featuresWANG JUDY·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →