Inventor · disambiguated record
Jui-Chun Weng
Also filed as: WENG JUI-CHUN
36 granted patents·7 pending applications·60 citations·filing 2004–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0196US11789360B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 0294US11782284B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 0392US11726342B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0492US11392024B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0591US9527721B2Movement microelectromechanical systems (MEMS) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·14 cites·20 claims
- 0690US10155656B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·5 cites·20 claims
- 0789US11454820B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·5 cites·20 claims
- 0889US11407636B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·4 cites·20 claims
- 0985US12242181B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1085US11448891B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·3 cites·20 claims
- 1185US11415878B2Pellicle frame with stress relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·1 cites·20 claims
- 1285US2025353736A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1384US12130551B2Pellicle frame with stress relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1484US2024361609A1Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1582US12092839B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1682US12054382B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1782US10513432B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1882US10131536B2Heater design for MEMS chamber pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·2 cites·20 claims
- 1981US12271006B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 2081US9884758B2Selective nitride outgassing process for MEMS cavity pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 2181US9880192B2Method of manufacturing a motion sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·4 cites·20 claims
- 2280US11726401B2Pellicle frame with stress relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 2378US12157667B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2478US11514707B2Optical sensor and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·19 claims
- 2578US11305980B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·7 claims
- 2677US12454455B2Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2775US12283568B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 2874US11655138B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2973US2025246578A1Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3071US2025323105A1Test structure and integrated circuit test using sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3170US9966427B2Metal-insulator-metal (MIM) capacitor with an electrode scheme for improved manufacturability and reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 3270US8960003B2Motion sensor device and methods for forming the sameCHENG SHYH-WEI·Filed 2012·Granted Feb 24, 2015·4 cites·12 claims
- 3368US9090452B2Mechanism for forming MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·2 cites·20 claims
- 3466US12387984B2Test structure and integrated circuit test using sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 3566US11742320B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·14 claims
- 3662US10532925B2Heater design for MEMS chamber pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 3760US2025372551A1Semiconductor structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3859US2025226342A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3958US9561954B2Method of fabricating MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·20 claims
- 4057US2025237941A1Pellicle for euv applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4154US8916943B2MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·0 cites·19 claims
- 4239US7023003B2Ion implanter and method of preventing undesirable ions from implanting a target waferTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 4, 2006·1 cites·13 claims
- 4335US8846149B2Delamination resistant semiconductor film and method for forming the sameCHANG YUH-HWA·Filed 2006·Granted Sep 30, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →