Inventor · disambiguated record
Jui-Ping Weng
Also filed as: WENG JUI-PING
17 granted patents·4 pending applications·169 citations·filing 2001–2015
94Inventor score
Files withVISERA TECHNOLOGIES CO LTD10IND TECH RES INST6WENG JUI-PING2KUO WU-CHENG1TSMC SOLID STATE LIGHTING LTD1
Top patents by PatentIndex Score
21 records- 0191US7521724B2Light emitting diode package and process of making the sameIND TECH RES INST·Filed 2005·Granted Apr 21, 2009·26 cites·37 claims
- 0287US7928655B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 19, 2011·17 cites·8 claims
- 0386US9484385B2Method for fabricating an image sensor packageVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Nov 1, 2016·4 cites·20 claims
- 0486US7928458B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 19, 2011·13 cites·11 claims
- 0585US7829966B2Electronic assembly for image sensor deviceVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Nov 9, 2010·8 cites·19 claims
- 0682US7994598B2Electronic assembly for image sensor deviceVISERA TECHNOLOGIES CO LTD·Filed 2010·Granted Aug 9, 2011·4 cites·8 claims
- 0781US7932529B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 26, 2011·11 cites·11 claims
- 0877US9231012B2Image sensor packageWENG JUI-PING·Filed 2007·Granted Jan 5, 2016·6 cites·12 claims
- 0976US6771158B2Micro electromechanical differential actuatorIND TECH RES INST·Filed 2002·Granted Aug 3, 2004·35 cites·11 claims
- 1072US7176457B2MEMS differential actuated nano probe and method for fabricationIND TECH RES INST·Filed 2005·Granted Feb 13, 2007·10 cites·3 claims
- 1172US6995368B2MEMS differential actuated nano probe and method for fabricationIND TECH RES INST·Filed 2004·Granted Feb 7, 2006·16 cites·3 claims
- 1267US7595220B2Image sensor package and fabrication method thereofVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Sep 29, 2009·3 cites·9 claims
- 1364US9136442B2Multi-vertical LED packaging structureTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Sep 15, 2015·2 cites·18 claims
- 1462US7133185B2MEMS optical switch with self-assembly structureIND TECH RES INST·Filed 2004·Granted Nov 7, 2006·8 cites·7 claims
- 1553US7898070B2Image sensor package and fabrication method thereofVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Mar 1, 2011·0 cites·10 claims
- 1650US8153458B2Image sensing devices and methods for fabricating the sameWENG JUI-PING·Filed 2009·Granted Apr 10, 2012·3 cites·8 claims
- 1748US6950224B1Electrostatic movable micro mirror chipIND TECH RES INST·Filed 2004·Granted Sep 27, 2005·3 cites·16 claims
- 1844US2008191334A1Glass dam structures for imaging devices chip scale packageVISERA TECHNOLOGIES CO LTD·Filed 2007·Application pending·0 cites
- 1943US2008169480A1Optoelectronic device package and packaging method thereofVISERA TECHNOLOGIES CO LTD·Filed 2007·Application pending·0 cites
- 2043US2010237379A1Light emitting deviceKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 2132US2002106157A1Method of making an optical waveguide fiber grating substrate and an optical device thereofFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →