Inventor · disambiguated record
Jung-Hwan Woo
Also filed as: WOO JUNG-HWAN
3 granted patents·5 pending applications·30 citations·filing 2004–2010
70Inventor score
Top patents by PatentIndex Score
8 records- 0183US7624498B2Apparatus for detaching a semiconductor chip from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·10 cites·18 claims
- 0277US7650687B2Die attaching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·7 cites·14 claims
- 0367US7215008B2In-line apparatus and method for manufacturing double-sided stacked multi-chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·13 cites·7 claims
- 0453US2010037445A1Method of and apparatus for detaching semiconductor chips from a tapeSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0546US2007170569A1In-line apparatus and method for manufacturing double-sided stacked multi-chip packagesKIM TAE-HYUN·Filed 2007·Application pending·0 cites
- 0640US2007277128A1System and method for sensing shape of chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0734US2006266792A1Multi-chip die bonder and methodKO YOUN-SUNG·Filed 2005·Application pending·0 cites
- 0829US2011079361A1Apparatus for semiconductor die bondingPARK BYEONG-KUK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →