Inventor · disambiguated record
Junho Yoon
Also filed as: YOON JUNHO
16 granted patents·21 pending applications·65 citations·filing 2008–2025
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD30YOON JUNHO3ELECTRONICS & TELECOMMUNICATIONS RES INST1HEWLETT PACKARD DEVELOPMENT CO1KWON O DAE1
Top patents by PatentIndex Score
37 records- 0192US9466629B2Image sensor and method of fabricating the sameYOON JUNHO·Filed 2015·Granted Oct 11, 2016·11 cites·20 claims
- 0292US9240441B2Semiconductor devices including a support for an electrode and methods of forming semiconductor devices including a support for an electrodeYOON JUNHO·Filed 2013·Granted Jan 19, 2016·20 cites·20 claims
- 0391US8698265B2Image sensor including a light shielding patternYOON JUNHO·Filed 2011·Granted Apr 15, 2014·11 cites·17 claims
- 0490US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0588US9647056B2Semiconductor devices including a support for an electrode and methods of forming semiconductor devices including a support for an electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 9, 2017·6 cites·10 claims
- 0686US8969167B2Methods of fabricating a semiconductor device with capacitors using mold structure and protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 3, 2015·9 cites·16 claims
- 0782US9859163B2Methods for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·4 cites·20 claims
- 0869US10607820B2Monitoring units, plasma treatment devices including the same, and methods of fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 31, 2020·1 cites·16 claims
- 0968US12513973B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·10 claims
- 1068US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 1168US2024038493A1Semiconductor processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1265US12512429B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1365US11854892B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 1462US2025125160A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1562US2025232986A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1661US2025249487A1Method of processing substrate and method of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1761US2025167012A1Substrate processing apparatus and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1860US11322405B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 1959US2025357413A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2024355678A1Methods of dicing wafers having arrays of semiconductor chips therein and semiconductor chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US2025125197A1Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2258US2025120194A1Image sensor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2357US2025293206A1Semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2456US8513036B2Photonic quantum ring laser and fabrication method thereofKWON O DAE·Filed 2012·Granted Aug 20, 2013·1 cites·9 claims
- 2556US2025046747A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2655US2024054424A1Method and apparatus for determining responses to dangerous situations based on degrees of dangerELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 2755US2024178000A1Wafer dicing method and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2853US2020373124A1Semiconductor processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2950US2010265977A1Photonic quantum ring laser and fabrication method thereofPOSTECH ACAD IND FOUND·Filed 2008·Application pending·0 cites
- 3050US2025323087A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3150US2025218810A1Substrate drying apparatus and substrate drying methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3249US2023082384A1Substrate processing apparatus and method of manufacturing semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3348US9123657B2Method of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 1, 2015·0 cites·20 claims
- 3447US2022392851A1Semiconductor chip and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3547US2024422269A1Changing model name according to provided functionHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Application pending·0 cites
- 3638US9812335B2Method of forming fine pattern of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·0 cites·19 claims
- 3732US2016314981A1Methods for forming pattern using cyclic processingSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →