Inventor · disambiguated record
Jun Zhai
Also filed as: ZHAI JUN · ZHAI JUN “CHARLIE”
107 granted patents·48 pending applications·927 citations·filing 2004–2025
99Inventor score
Files withAPPLE INC125CHICAGO MERCANTILE EXCHANGE INC8ADVANCED MICRO DEVICES INC6ZHAI JUN3GLOBALFOUNDRIES INC2
Top patents by PatentIndex Score
155 records- 0199US11476203B2Die-to-die routing through a seal ringAPPLE INC·Filed 2021·Granted Oct 18, 2022·8 cites·20 claims
- 0298US11587909B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2020·Granted Feb 21, 2023·9 cites·18 claims
- 0398US11309246B2High density 3D interconnect configurationAPPLE INC·Filed 2020·Granted Apr 19, 2022·10 cites·20 claims
- 0498US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0598US9601471B2Three layer stack structureAPPLE INC·Filed 2015·Granted Mar 21, 2017·34 cites·16 claims
- 0698US9559081B1Independent 3D stackingAPPLE INC·Filed 2015·Granted Jan 31, 2017·268 cites·19 claims
- 0797US12021035B2Interconnecting dies by stitch routingAPPLE INC·Filed 2022·Granted Jun 25, 2024·2 cites·15 claims
- 0897US11862557B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2021·Granted Jan 2, 2024·4 cites·11 claims
- 0997US11728266B2Die stitching and harvesting of arrayed structuresAPPLE INC·Filed 2020·Granted Aug 15, 2023·6 cites·14 claims
- 1097US11217563B2Fully interconnected heterogeneous multi-layer reconstructed silicon deviceAPPLE INC·Filed 2020·Granted Jan 4, 2022·4 cites·18 claims
- 1197US10985107B2Systems and methods for forming die sets with die-to-die routing and metallic sealsAPPLE INC·Filed 2019·Granted Apr 20, 2021·12 cites·20 claims
- 1297US10943869B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2017·Granted Mar 9, 2021·22 cites·20 claims
- 1397US9935076B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2016·Granted Apr 3, 2018·16 cites·10 claims
- 1497US9935087B2Three layer stack structureAPPLE INC·Filed 2017·Granted Apr 3, 2018·23 cites·14 claims
- 1597US9679801B2Dual molded stack TSV packageAPPLE INC·Filed 2015·Granted Jun 13, 2017·25 cites·17 claims
- 1697US9659907B2Double side mounting memory integration in thin low warpage fanout packageAPPLE INC·Filed 2015·Granted May 23, 2017·26 cites·20 claims
- 1797US9661411B1Integrated MEMS microphone and vibration sensorAPPLE INC·Filed 2016·Granted May 23, 2017·62 cites·20 claims
- 1897US9595514B2Package with SoC and integrated memoryAPPLE INC·Filed 2016·Granted Mar 14, 2017·16 cites·20 claims
- 1997US9583472B2Fan out system in package and method for forming the sameAPPLE INC·Filed 2015·Granted Feb 28, 2017·28 cites·18 claims
- 2096US12368137B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2023·Granted Jul 22, 2025·2 cites·19 claims
- 2196US12283549B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2023·Granted Apr 22, 2025·2 cites·15 claims
- 2296US11749631B2Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliabilityAPPLE INC·Filed 2020·Granted Sep 5, 2023·4 cites·16 claims
- 2396US10756622B2Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2018·Granted Aug 25, 2020·12 cites·22 claims
- 2496US9589936B23D integration of fanout wafer level packagesAPPLE INC·Filed 2015·Granted Mar 7, 2017·19 cites·20 claims
- 2595US12087689B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2023·Granted Sep 10, 2024·2 cites·16 claims
- 2695US9305959B2Biometric sensor chip having distributed sensor and control circuitryAPPLE INC·Filed 2014·Granted Apr 5, 2016·10 cites·13 claims
- 2794US9548288B1Integrated circuit die decoupling system with reduced inductanceAPPLE INC·Filed 2015·Granted Jan 17, 2017·17 cites·17 claims
- 2893US11646302B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2020·Granted May 9, 2023·4 cites·30 claims
- 2993US11594494B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 3093US11561144B1Wearable electronic device with fluid-based pressure sensingAPPLE INC·Filed 2019·Granted Jan 24, 2023·8 cites·20 claims
- 3193US10056327B2SOC with integrated voltage regulator using preformed MIM capacitor waferAPPLE INC·Filed 2017·Granted Aug 21, 2018·7 cites·20 claims
- 3292US10290620B2Package with SoC and integrated memoryAPPLE INC·Filed 2017·Granted May 14, 2019·7 cites·20 claims
- 3391US11158607B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2019·Granted Oct 26, 2021·4 cites·19 claims
- 3491US10770433B1High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2019·Granted Sep 8, 2020·5 cites·20 claims
- 3591US8963311B2PoP structure with electrically insulating material between packagesAPPLE INC·Filed 2012·Granted Feb 24, 2015·11 cites·13 claims
- 3690US12451436B2Interconnecting a plurality of dies having spare input/output circuitAPPLE INC·Filed 2024·Granted Oct 21, 2025·0 cites·16 claims
- 3790US11735526B2High density 3D interconnect configurationAPPLE INC·Filed 2022·Granted Aug 22, 2023·1 cites·20 claims
- 3890US11735567B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2021·Granted Aug 22, 2023·1 cites·22 claims
- 3990US10181455B23D thin profile pre-stacking architecture using reconstitution methodAPPLE INC·Filed 2017·Granted Jan 15, 2019·6 cites·19 claims
- 4089US10818632B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2018·Granted Oct 27, 2020·3 cites·14 claims
- 4189US9883822B2Biometric sensor chip having distributed sensor and control circuitryAPPLE INC·Filed 2016·Granted Feb 6, 2018·11 cites·16 claims
- 4289US9331058B2Package with SoC and integrated memoryAPPLE INC·Filed 2013·Granted May 3, 2016·8 cites·18 claims
- 4388US12033982B2Fully interconnected heterogeneous multi-layer reconstructed silicon deviceAPPLE INC·Filed 2021·Granted Jul 9, 2024·1 cites·19 claims
- 4488US11532563B2Package integration using fanout cavity substrateAPPLE INC·Filed 2020·Granted Dec 20, 2022·2 cites·16 claims
- 4588US2025015033A1Multi-Die Fine Grain Integrated Voltage RegulationAPPLE INC·Filed 2024·Application pending·0 cites
- 4687US11515261B2Multiple component integration in fanout package with different back side metallization and thicknessesAPPLE INC·Filed 2020·Granted Nov 29, 2022·2 cites·16 claims
- 4787US8405187B2Chip package with channel stiffener frameTOSAYA ERIC·Filed 2011·Granted Mar 26, 2013·12 cites·20 claims
- 4886US9679187B2Finger biometric sensor assembly including direct bonding interface and related methodsAPPLE INC·Filed 2015·Granted Jun 13, 2017·5 cites·26 claims
- 4985US12074077B2Flexible package architecture concept in fanoutAPPLE INC·Filed 2020·Granted Aug 27, 2024·2 cites·12 claims
- 5085US11967528B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
Showing the top 50 of 155 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →