Inventor · disambiguated record
Kazuto Aizawa
Also filed as: AIZAWA KAZUTO
5 granted patents·4 citations·filing 2017–2020
67Inventor score
Technology areasH10P
Files withLINTEC CORP5
Top patents by PatentIndex Score
5 records- 0186US10854495B2Adhesive tape for semiconductor processing, and semiconductor device manufacturing methodLINTEC CORP·Filed 2017·Granted Dec 1, 2020·4 cites·11 claims
- 0268US11322385B2Adhesive tape for semiconductor processing, and semiconductor device manufacturing methodLINTEC CORP·Filed 2020·Granted May 3, 2022·0 cites·4 claims
- 0356US11183416B2Adhesive tape for semiconductor processing, and semiconductor device manufacturing methodLINTEC CORP·Filed 2017·Granted Nov 23, 2021·0 cites·15 claims
- 0453US11842916B2Semiconductor processing adhesive tape and method of manufacturing semiconductor deviceLINTEC CORP·Filed 2019·Granted Dec 12, 2023·0 cites·6 claims
- 0552US11942353B2Adhesive tape for semiconductor processing and method for producing semiconductor deviceLINTEC CORP·Filed 2019·Granted Mar 26, 2024·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →