Inventor · disambiguated record
Katsuo Arai
Also filed as: ARAI KATSUO
10 granted patents·3 pending applications·514 citations·filing 1986–2014
91Inventor score
Top patents by PatentIndex Score
13 records- 0195US6474987B1Wafer holderMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Nov 5, 2002·355 cites·13 claims
- 0291US7220617B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted May 22, 2007·21 cites·11 claims
- 0387US8314484B2Semiconductor device and method of manufacturing the sameKAJIWARA RYOICHI·Filed 2010·Granted Nov 20, 2012·9 cites·10 claims
- 0486US8114710B2Manufacturing method of resin-sealed semiconductor deviceMUTO AKIRA·Filed 2009·Granted Feb 14, 2012·16 cites·3 claims
- 0586US7405469B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 29, 2008·12 cites·10 claims
- 0686US7374965B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted May 20, 2008·14 cites·22 claims
- 0774US5304512AProcess for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the processHITACHI LTD·Filed 1992·Granted Apr 19, 1994·56 cites·61 claims
- 0868US4698904AApparatus for assembling fins and tubes for heat exchangersHITACHI LTD·Filed 1986·Granted Oct 13, 1987·21 cites·3 claims
- 0962US8492202B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Jul 23, 2013·1 cites·10 claims
- 1060US6838315B2Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulatorRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·9 cites·8 claims
- 1151US2008268577A1Semiconductor device and method of manufacturing the sameKAGII HIDEMASA·Filed 2008·Application pending·0 cites
- 1249US2008220568A1Manufacturing method of semiconductor deviceMUTO AKIRA·Filed 2008·Application pending·0 cites
- 1343US2014264383A1Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →