Inventor · disambiguated record
Kazuhiro Atsumi
Also filed as: ATSUMI KAZUHIRO
26 granted patents·1 pending application·975 citations·filing 1994–2019
97Inventor score
Files withHAMAMATSU PHOTONICS KK7ATSUMI KAZUHIRO5BIO SENSOR KENKYUSHO KK3FUKUMITSU KENSHI3FUKUYO FUMITSUGU3
Top patents by PatentIndex Score
27 records- 0199US7626137B2Laser cutting by forming a modified region within an object and generating fracturesHAMAMATSU PHOTONICS KK·Filed 2005·Granted Dec 1, 2009·130 cites·24 claims
- 0299US7615721B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 10, 2009·118 cites·12 claims
- 0399US7592238B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Sep 22, 2009·123 cites·42 claims
- 0499US7547613B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 16, 2009·144 cites·12 claims
- 0596US8685838B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Apr 1, 2014·93 cites·9 claims
- 0696US8058103B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2009·Granted Nov 15, 2011·34 cites·8 claims
- 0792US8816245B2Method of cutting object to be processedIWAKI HIROYUKI·Filed 2011·Granted Aug 26, 2014·14 cites·8 claims
- 0890US9012805B2Laser working methodATSUMI KAZUHIRO·Filed 2007·Granted Apr 21, 2015·14 cites·15 claims
- 0990US8624153B2Laser processing method and deviceATSUMI KAZUHIRO·Filed 2004·Granted Jan 7, 2014·40 cites·8 claims
- 1089US8950217B2Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass memberIWAKI HIROYUKI·Filed 2011·Granted Feb 10, 2015·12 cites·8 claims
- 1189US8735770B2Laser processing method for forming a modified region in an objectKUNO KOJI·Filed 2007·Granted May 27, 2014·16 cites·24 claims
- 1287US5637874AApparatus and method for measuring chemiluminescenceBIO SENSOR KENKYUSHO KK·Filed 1995·Granted Jun 10, 1997·120 cites·17 claims
- 1386US8933368B2Laser processing method for cutting planar objectATSUMI KAZUHIRO·Filed 2007·Granted Jan 13, 2015·12 cites·10 claims
- 1486US8551817B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2011·Granted Oct 8, 2013·6 cites·12 claims
- 1586US8513567B2Laser processing method for forming a modified region for cutting in an objectOSAJIMA TETSUYA·Filed 2006·Granted Aug 20, 2013·17 cites·11 claims
- 1685US8247734B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Aug 21, 2012·29 cites·9 claims
- 1781US8563893B2Laser material processing systemKUNO KOJI·Filed 2006·Granted Oct 22, 2013·7 cites·4 claims
- 1873US8993922B2Laser processing method and deviceATSUMI KAZUHIRO·Filed 2004·Granted Mar 31, 2015·17 cites·24 claims
- 1971US8890027B2Laser processing method and laser processing systemFUKUYO FUMITSUGU·Filed 2007·Granted Nov 18, 2014·4 cites·6 claims
- 2064US11241757B2Laser processing method and deviceHAMAMATSU PHOTONICS KK·Filed 2019·Granted Feb 8, 2022·0 cites·7 claims
- 2158US10293433B2Laser processing method and deviceHAMAMATSU PHOTONICS KK·Filed 2016·Granted May 21, 2019·0 cites·7 claims
- 2258US9511449B2Laser processing method and deviceHAMAMATSU PHOTONICS KK·Filed 2013·Granted Dec 6, 2016·0 cites·1 claims
- 2355US9352414B2Laser processing method and deviceATSUMI KAZUHIRO·Filed 2004·Granted May 31, 2016·6 cites·20 claims
- 2444US2007085099A1Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2004·Application pending·0 cites
- 2537US6161878AExternal cover pipe for fluid transport pipeWATERWORKS TECHNOLOGY DEV ORG·Filed 1998·Granted Dec 19, 2000·10 cites·8 claims
- 2635US5523845AA fiber optic device for measuring liquids which are drawn into an end of the device to a predetermined distance from the end of the optical fibersBIO SENSOR KENKYUSHO KK·Filed 1995·Granted Jun 4, 1996·7 cites·11 claims
- 2727US5576212AOxidizing composition in powder formBIO SENSOR KENKYUSHO KK·Filed 1994·Granted Nov 19, 1996·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →