Inventor · disambiguated record
Kanta Dei
Also filed as: DEI Kanta
7 granted patents·6 pending applications·2 citations·filing 2018–2025
71Inventor score
Files withSENJU METAL INDUSTRY CO13
Top patents by PatentIndex Score
13 records- 0188US12053843B2Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 6, 2024·1 cites·10 claims
- 0284US11633815B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2019·Granted Apr 25, 2023·1 cites·7 claims
- 0373US2025276412A1Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder JointSENJU METAL INDUSTRY CO·Filed 2025·Application pending·0 cites
- 0471US12447564B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 0571US12383987B2Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Aug 12, 2025·0 cites·9 claims
- 0660US12080671B2Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2022·Granted Sep 3, 2024·0 cites·18 claims
- 0760US2024399512A1Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 0859US12377500B2Lead-free and antimony-free solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 5, 2025·0 cites·10 claims
- 0953US2024238912A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1053US2024238914A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1153US2024238913A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1251US11607753B2Solder alloy, cast article, formed article, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 21, 2023·0 cites·8 claims
- 1351US2021001431A1Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →