US2021001431A1PendingUtilityA1

Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint

Assignee: SENJU METAL INDUSTRY COPriority: Mar 8, 2018Filed: Dec 21, 2018Published: Jan 7, 2021

Est. expiryMar 8, 2038(~11.6 yrs left)· nominal 20-yr term from priority

Inventors:Takahiro Yokoyama Kanta Dei Takahiro Matsufuji Hikaru Nomura Shunsaku Yoshikawa

C22C 13/02B23K 35/264B23K 35/262C22C 12/00B23K 35/025B23K 35/26B23K 35/0244B23K 2103/08

PatentIndex Score

Cited by

References

Claims

Abstract

A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder ball includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn.

Claims

exact text as granted — not AI-modified

1 . A solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. 
     
     
         2 . The solder alloy according to  claim 1 , wherein the alloy composition contains 1.0 to 2.0 mass % of In. 
     
     
         3 . The solder alloy according to  claim 1 , wherein the alloy composition contains 0.01 to 0.03 mass % of Pd. 
     
     
         4 . The solder alloy according to  claim 1 , wherein the alloy composition further contains at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. 
     
     
         5 . The solder alloy according to  claim 1 , wherein the alloy composition further contains at least one of P, Ge, and Ga in total amount of 0.1 mass % or less. 
     
     
         6 . A solder paste comprising a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. 
     
     
         7 . A solder ball comprising a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. 
     
     
         8 . A resin flux-cored solder comprising the solder alloy according to  claim 1 . 
     
     
         9 . A solder joint comprising the solder alloy according to  claim 1 .

Join the waitlist — get patent alerts

Track US2021001431A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.