Inventor · disambiguated record
Takahiro Yokoyama
Also filed as: YOKOYAMA TAKAHIRO
47 granted patents·26 pending applications·252 citations·filing 1995–2025
97Inventor score
Files withTOKYO ELECTRON LTD17DAIKIN IND LTD10SENJU METAL INDUSTRY CO10RENESAS TECH CORP7HITACHI LTD5
Top patents by PatentIndex Score
73 records- 0196US11551937B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Jan 10, 2023·2 cites·36 claims
- 0295US11615964B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Mar 28, 2023·2 cites·30 claims
- 0393US11750131B2Motor drive method and motor drive apparatusDAIKIN IND LTD·Filed 2020·Granted Sep 5, 2023·2 cites·18 claims
- 0489US7646642B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Jan 12, 2010·20 cites·9 claims
- 0586US11123824B2Solder alloySENJU METAL INDUSTRY CO·Filed 2018·Granted Sep 21, 2021·1 cites·6 claims
- 0684US11313343B2Hydroelectric power generation systemDAIKIN IND LTD·Filed 2018·Granted Apr 26, 2022·3 cites·8 claims
- 0784US2025046615A1Etching methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0883US10067270B2Electromagnetic wave absorbing/radiating material, method of manufacturing same, and infrared sourceNAT INST MATERIALS SCIENCE·Filed 2015·Granted Sep 4, 2018·5 cites·39 claims
- 0982US12142484B2Etching methodTOKYO ELECTRON LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1082US8130804B2Laser diode and method of manufacturing the sameNAKASHIMA MAKOTO·Filed 2009·Granted Mar 6, 2012·7 cites·8 claims
- 1181US11041476B2Hydroelectric power generation systemDAIKIN IND LTD·Filed 2017·Granted Jun 22, 2021·4 cites·10 claims
- 1280US5982236AHigh-frequency power amplifierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 9, 1999·46 cites·16 claims
- 1379US8129771B2Semiconductor memory deviceYOKOYAMA TAKAHIRO·Filed 2010·Granted Mar 6, 2012·10 cites·4 claims
- 1479US7514737B2Semiconductor memory deviceRENESAS TECH CORP·Filed 2006·Granted Apr 7, 2009·9 cites·8 claims
- 1578US2025349552A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1672US11736050B2Motor drive method and motor drive apparatusDAIKIN IND LTD·Filed 2020·Granted Aug 22, 2023·0 cites·12 claims
- 1771US11992902B2Solder alloy and solder jointSENJU METAL INDUSTRY CO·Filed 2022·Granted May 28, 2024·0 cites·4 claims
- 1871US11367610B2Film forming and process container cleaning methodTOKYO ELECTRON LTD·Filed 2019·Granted Jun 21, 2022·1 cites·19 claims
- 1970US12387941B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·19 claims
- 2069US10500680B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Dec 10, 2019·1 cites·16 claims
- 2169US2023207343A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2268US7957195B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 7, 2011·5 cites·7 claims
- 2366US10846212B2Evidence gathering system and methodHITACHI LTD·Filed 2016·Granted Nov 24, 2020·1 cites·6 claims
- 2466US6472929B2Semiconductor deviceFUJITSU LTD·Filed 2001·Granted Oct 29, 2002·15 cites·9 claims
- 2565US11600501B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2665US11241760B2Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 2765US6741510B2Semiconductor memory device capable of performing burn-in test at high speedRENESAS TECH CORP·Filed 2002·Granted May 25, 2004·14 cites·11 claims
- 2863US2025151227A1Control device and non-transitory computer-readable storage mediumDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 2962US8802458B2Laser diode and method of manufacturing the sameNAKASHIMA MAKOTO·Filed 2012·Granted Aug 12, 2014·1 cites·5 claims
- 3061US6429471B1Compound semiconductor field effect transistor and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 6, 2002·10 cites·3 claims
- 3160US2024312771A1Etching method, plasma processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3260US2024399512A1Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 3359US11898532B2Hydropower generation system and power generator control methodDAIKIN IND LTD·Filed 2022·Granted Feb 13, 2024·0 cites·9 claims
- 3459US2024162047A1Etching method, method for manufacturing semiconductor device, etching program, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3559US2025058414A1Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 3659US2024317582A1Ozone generating body, ozone generating unit, and ozone generatorNITERRA CO LTD·Filed 2022·Application pending·0 cites
- 3758US11824472B2Motor drive apparatus and cooling apparatusDAIKIN IND LTD·Filed 2021·Granted Nov 21, 2023·0 cites·11 claims
- 3858US7064398B2Semiconductor memory deviceRENESAS TECH CORP·Filed 2004·Granted Jun 20, 2006·10 cites·9 claims
- 3958US6781869B2Semiconductor memoryRENESAS TECH CORP·Filed 2002·Granted Aug 24, 2004·10 cites·10 claims
- 4057US8619826B2Laser diodeNAKASHIMA MAKOTO·Filed 2010·Granted Dec 31, 2013·1 cites·7 claims
- 4157US8144518B2Semiconductor deviceFUJITO MASAMICHI·Filed 2011·Granted Mar 27, 2012·2 cites·5 claims
- 4257US5733625ANon-woven fabricJAPAN VILENE CO LTD·Filed 1995·Granted Mar 31, 1998·32 cites·25 claims
- 4357US2024101420A1Ozone generatorNITERRA CO LTD·Filed 2022·Application pending·0 cites
- 4455US8619829B2Semiconductor laser deviceYOSHIDA YUTA·Filed 2010·Granted Dec 31, 2013·1 cites·9 claims
- 4555US6891743B2Semiconductor memory device having a capacitive plate to reduce soft errorsRENESAS TECH CORP·Filed 2002·Granted May 10, 2005·6 cites·12 claims
- 4654US11417535B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 16, 2022·0 cites·17 claims
- 4754US2024102957A1Electrochemical gas sensor, ozone generator, and humidifierNGK SPARK PLUG CO·Filed 2022·Application pending·0 cites
- 4853US2024238912A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 4953US2025137698A1Fluid transfer apparatusDAIKIN IND LTD·Filed 2024·Application pending·0 cites
- 5053US2024238914A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →