Inventor · disambiguated record
Takahiro Matsufuji
Also filed as: MATSUFUJI Takahiro
6 granted patents·5 pending applications·2 citations·filing 2018–2024
68Inventor score
Files withSENJU METAL INDUSTRY CO11
Top patents by PatentIndex Score
11 records- 0193US12109653B2Solder alloy, solder ball, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2023·Granted Oct 8, 2024·1 cites·11 claims
- 0288US12053843B2Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 6, 2024·1 cites·10 claims
- 0381US2024424615A1Solder Alloy, Solder Ball, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0471US12447564B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 0565US11241760B2Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 0659US12377500B2Lead-free and antimony-free solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 5, 2025·0 cites·10 claims
- 0753US2024238912A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0853US2024238914A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0953US2024238913A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1051US11607753B2Solder alloy, cast article, formed article, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 21, 2023·0 cites·8 claims
- 1151US2021001431A1Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →