Inventor · disambiguated record
Shunsaku Yoshikawa
Also filed as: YOSHIKAWA SHUNSAKU
32 granted patents·18 pending applications·22 citations·filing 2009–2025
94Inventor score
Files withSENJU METAL INDUSTRY CO42YOSHIKAWA SHUNSAKU3ISHIBASHI SEIKO1SAKAMOTO YOSHITSUGU1SHIMAMURA MASATO1
Top patents by PatentIndex Score
50 records- 0193US12109653B2Solder alloy, solder ball, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2023·Granted Oct 8, 2024·1 cites·11 claims
- 0288US12053843B2Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 6, 2024·1 cites·10 claims
- 0388US10213879B2Solder alloySENJU METAL INDUSTRY CO·Filed 2016·Granted Feb 26, 2019·2 cites·4 claims
- 0487US11628520B2Preform solder and method of manufacturing the same, and method of manufacturing solder jointSENJU METAL INDUSTRY CO·Filed 2022·Granted Apr 18, 2023·1 cites·3 claims
- 0587US11577344B2Solder alloySENJU METAL INDUSTRY CO·Filed 2021·Granted Feb 14, 2023·1 cites·4 claims
- 0686US11123824B2Solder alloySENJU METAL INDUSTRY CO·Filed 2018·Granted Sep 21, 2021·1 cites·6 claims
- 0785US10717158B2Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering methodSENJU METAL INDUSTRY CO·Filed 2017·Granted Jul 21, 2020·2 cites·10 claims
- 0884US11633815B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2019·Granted Apr 25, 2023·1 cites·7 claims
- 0982US2025065449A1Method for step-solderingSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1081US2024424615A1Solder Alloy, Solder Ball, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1181US2024363571A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1278US12179291B2Method for step-solderingSENJU METAL INDUSTRY CO·Filed 2023·Granted Dec 31, 2024·0 cites·9 claims
- 1376US11772204B2Preform solder and method of manufacturing the same, and method of manufacturing solder jointSENJU METAL INDUSTRY CO·Filed 2023·Granted Oct 3, 2023·0 cites·2 claims
- 1476US11167379B2Solder alloy, solder ball, solder preform, solder paste and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Nov 9, 2021·1 cites·13 claims
- 1575US9780055B2Lead-free solder ballYAMANAKA YOSHIE·Filed 2012·Granted Oct 3, 2017·4 cites·11 claims
- 1673US2025276412A1Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder JointSENJU METAL INDUSTRY CO·Filed 2025·Application pending·0 cites
- 1772US9837757B2Lead-free solder alloy and in-vehicle electronic circuitSENJU METAL INDUSTRY CO·Filed 2014·Granted Dec 5, 2017·2 cites·19 claims
- 1871US12447564B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 1971US12383987B2Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Aug 12, 2025·0 cites·9 claims
- 2071US11992902B2Solder alloy and solder jointSENJU METAL INDUSTRY CO·Filed 2022·Granted May 28, 2024·0 cites·4 claims
- 2170US10343238B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2017·Granted Jul 9, 2019·1 cites·12 claims
- 2269US10500680B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Dec 10, 2019·1 cites·16 claims
- 2365US11241760B2Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 2465US2022040802A1Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit boardSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 2560US10967464B2Solder alloy, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 6, 2021·0 cites·3 claims
- 2660US2024399512A1Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 2759US12377500B2Lead-free and antimony-free solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 5, 2025·0 cites·10 claims
- 2859US2025058414A1Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 2959US2019118310A1Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic ComponentYOSHIKAWA SHUNSAKU·Filed 2018·Application pending·0 cites
- 3058US10350712B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2014·Granted Jul 16, 2019·0 cites·6 claims
- 3158US9987710B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2014·Granted Jun 5, 2018·0 cites·8 claims
- 3256US9844837B2Lead-free solder alloySHIMAMURA MASATO·Filed 2012·Granted Dec 19, 2017·1 cites·5 claims
- 3356US8975757B2Lead-free solder connection structure and solder ballUESHIMA MINORU·Filed 2009·Granted Mar 10, 2015·1 cites·20 claims
- 3456US2017274481A1Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic ComponentSENJU METAL INDUSTRY CO·Filed 2015·Application pending·0 cites
- 3556US2019088611A1"Lead-Free Solder Ball"SENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 3654US9808890B2Solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Nov 7, 2017·0 cites·8 claims
- 3754US8896119B2Bonding material for semiconductor devicesSAKAMOTO YOSHITSUGU·Filed 2011·Granted Nov 25, 2014·1 cites·11 claims
- 3853US2018005970A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2017·Application pending·0 cites
- 3953US2015328722A1Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2012·Application pending·0 cites
- 4053US2024238912A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 4153US2024238914A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 4253US2024238913A1Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit DeviceSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 4351US11607753B2Solder alloy, cast article, formed article, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 21, 2023·0 cites·8 claims
- 4451US2021001431A1Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 4550US10076808B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Sep 18, 2018·0 cites·7 claims
- 4650US2019076966A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 4746US10137536B2Sn-Cu-based lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2012·Granted Nov 27, 2018·0 cites·7 claims
- 4845US9773721B2Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2014·Granted Sep 26, 2017·0 cites·15 claims
- 4942US8932519B2Solder alloyISHIBASHI SEIKO·Filed 2012·Granted Jan 13, 2015·0 cites·6 claims
- 5036US2012199393A1Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →