Inventor · disambiguated record
Kai Ding
Also filed as: DING KAI
1 granted patent·8 pending applications·14 citations·filing 2008–2025
36Inventor score
Top patents by PatentIndex Score
9 records- 0177US8277678B2Polymer-bonded magnetic materialsCHENG KA WAI ERIC·Filed 2008·Granted Oct 2, 2012·14 cites·10 claims
- 0272US2024186458A1High-density micro-led arrays with reflective sidewallsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0369US2023343904A1High-density micro-led arrays with reflective sidewallsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0469US2025167363A1Long-acting humidity-control material for battery packs and method for preparing sameNINGBO BOOER NEW MAT CO LTD·Filed 2023·Application pending·0 cites
- 0560US2025056920A1Die repair process in microled display fabricationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0658US2024096854A1Pixel isolation structures and methods of making themAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0756US2023290909A1Display pixels made from stacked micro-led structures and photoluminescent materialsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0855US2025132421A1Flame-retardant, thermal-insulating, and fireproof material for batteriesNINGBO BOOER NEW MAT CO LTD·Filed 2023·Application pending·0 cites
- 0952US2025318351A1Hybrid pixel structure for microled applicationsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kai Ding files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →