Inventor · disambiguated record
Kazuhide Doi
Also filed as: DOI KAZUHIDE
10 granted patents·2 pending applications·655 citations·filing 1994–2013
91Inventor score
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12 records- 0194US5629566AFlip-chip semiconductor devices having two encapsulantsTOSHIBA KK·Filed 1995·Granted May 13, 1997·199 cites·18 claims
- 0293US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0390US5648686AConnecting electrode portion in semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 15, 1997·115 cites·22 claims
- 0489US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0582US6742701B2Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2002·Granted Jun 1, 2004·26 cites·31 claims
- 0663US9033248B2Semiconductor storage deviceSUZUKI HIDETOSHI·Filed 2012·Granted May 19, 2015·2 cites·6 claims
- 0758US5530289ASemiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1994·Granted Jun 25, 1996·25 cites·10 claims
- 0857US5645123ASemiconductor device having temperature regulation means formed in circuit boardTOSHIBA KK·Filed 1994·Granted Jul 8, 1997·24 cites·8 claims
- 0944US9236329B2Semiconductor memory cardTOSHIBA KK·Filed 2013·Granted Jan 12, 2016·0 cites·9 claims
- 1040US2004238602A1Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2004·Application pending·0 cites
- 1136US2014233195A1Semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1235US8575738B2Semiconductor memory cardDOI KAZUHIDE·Filed 2012·Granted Nov 5, 2013·0 cites·20 claims
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