Inventor · disambiguated record
Kazuhiro Fuke
Also filed as: FUKE KAZUHIRO
29 granted patents·25 pending applications·35 citations·filing 2007–2022
94Inventor score
Top patents by PatentIndex Score
54 records- 0196US10767068B2Photocurable inkjet printing ink compositionSAKATA INX CORP·Filed 2017·Granted Sep 8, 2020·7 cites·14 claims
- 0293US10550275B2UV-LED curable clear ink composition for ink jet printingSAKATA INX CORP·Filed 2015·Granted Feb 4, 2020·4 cites·1 claims
- 0392US11230647B2Photocurable clear ink composition for inkjet printingSAKATA INX CORP·Filed 2017·Granted Jan 25, 2022·4 cites·12 claims
- 0489US11912881B2Ink composition for photo-curable ink jet printingSAKATA INX CORP·Filed 2019·Granted Feb 27, 2024·2 cites·4 claims
- 0583US11414558B2Photocurable inkjet printing ink compositionSAKATA INX CORP·Filed 2019·Granted Aug 16, 2022·1 cites·8 claims
- 0673US8378442B2Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor deviceNITTO DENKO CORP·Filed 2010·Granted Feb 19, 2013·1 cites·5 claims
- 0771US9082940B2Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jul 14, 2015·3 cites·12 claims
- 0870US8975101B2Element connecting board, producing method thereof, and light emitting diode deviceNITTO DENKO CORP·Filed 2014·Granted Mar 10, 2015·2 cites·1 claims
- 0968US11654656B2Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement memberNITTO DENKO CORP·Filed 2018·Granted May 23, 2023·0 cites·8 claims
- 1068US8624343B2Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor deviceFUKE KAZUHIRO·Filed 2012·Granted Jan 7, 2014·4 cites·16 claims
- 1167US11654655B2Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement memberNITTO DENKO CORP·Filed 2018·Granted May 23, 2023·0 cites·10 claims
- 1266US12503618B2Photocurable inkjet printing ink compositionSAKATA INX CORP·Filed 2021·Granted Dec 23, 2025·0 cites·4 claims
- 1365US2025382485A1Ink composition for ultraviolet-curable inkjet printingSAKATA INX CORP·Filed 2022·Application pending·0 cites
- 1464US2025034417A1Photocurable inkjet printing ink compositionSAKATA INX CORP·Filed 2022·Application pending·0 cites
- 1563US8963180B2Epoxy resin composition for optical semiconductor device and optical semiconductor device using the sameONISHI HIDENORI·Filed 2012·Granted Feb 24, 2015·2 cites·10 claims
- 1663US8017670B2Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the sameNITTO DENKO CORP·Filed 2007·Granted Sep 13, 2011·3 cites·5 claims
- 1763US2024279481A1Anti-migration coating agentSAKATA INX CORP·Filed 2022·Application pending·0 cites
- 1861US2024405328A1Thermal insulation material for battery and nonaqueous electrolyte secondary batteryNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1959US2024018373A1Active energy ray-curable inkjet ink compositionSAKATA INX CORP·Filed 2021·Application pending·0 cites
- 2057US9450158B2Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin compositionNITTO DENKO CORP·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 2157US7986050B2Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2009·Granted Jul 26, 2011·1 cites·9 claims
- 2256US12110399B2Photocurable inkjet printing ink compositionSAKATA INX CORP·Filed 2019·Granted Oct 8, 2024·0 cites·6 claims
- 2354US9287473B2Epoxy resin composition for optical semiconductor device and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2014·Granted Mar 15, 2016·0 cites·4 claims
- 2453US11476586B2Radio wave absorbing member, radio wave absorbing structure, and inspection apparatusNITTO DENKO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·8 claims
- 2552US10584253B2Light-curable inkjet printing ink compositionSAKATA INX CORP·Filed 2016·Granted Mar 10, 2020·0 cites·12 claims
- 2652US8466483B2Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor deviceOHNISHI HIDENORI·Filed 2011·Granted Jun 18, 2013·1 cites·8 claims
- 2751US2024400464A1Thermal insulation material and method for producing thermal insulation materialNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 2851US2014367729A1Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2950US8907502B2Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Dec 9, 2014·0 cites·7 claims
- 3050US2022201886A1Cover, cover-attached part, and radar deviceNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 3149US12185514B2Electromagnetic shieldNITTO DENKO CORP·Filed 2022·Granted Dec 31, 2024·0 cites·14 claims
- 3249US2025122391A1Ink composition for ultraviolet-curable inkjet printingSAKATA INX CORP·Filed 2022·Application pending·0 cites
- 3348US10035919B2Photocurable ink composition for inkjet printingSAKATA INX CORP·Filed 2015·Granted Jul 31, 2018·0 cites·4 claims
- 3448US8872211B2Element-connecting board, producing method thereof, and light-emitting diode deviceOOYABU YASUNARI·Filed 2012·Granted Oct 28, 2014·0 cites·9 claims
- 3548US2015057380A1Vinyl chloride-based copolymer porous body and method for producing sameKANEKA CORP·Filed 2012·Application pending·0 cites
- 3646US11964439B2Reinforcement structure and producing method of reinforcement structureNITTO DENKO CORP·Filed 2018·Granted Apr 23, 2024·0 cites·10 claims
- 3746US9029894B2Lead frame for optical semiconductor device and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2013·Granted May 12, 2015·0 cites·8 claims
- 3845US2024119196A1Method for designing radio scattering bodies, radio scattering body design apparatus, and program for designing radio scattering bodiesNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 3943US2024107729A1Electromagnetic shieldNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 4042US2013328091A1Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting memberNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4141US2014001948A1Reflecting layer-phosphor layer-covered led, producing method thereof, led device, and producing method thereofNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4241US2014001949A1Phosphor layer-covered led, producing method thereof, and led deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4341US2023077842A1Composite material and electromagnetic wave absorber made by molding sameNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 4441US2014009060A1Phosphor layer-covered led, producing method thereof, and led deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4540US10543695B2Photocurable white ink composition for inkjet printingSAKATA INX CORP·Filed 2015·Granted Jan 28, 2020·0 cites·2 claims
- 4640US2024121928A1Electromagnetic shield and assemblyNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 4740US2024373607A1Electromagnetic shieldNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 4840US2024098951A1Electromagnetic shieldNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 4940US2024380106A1Electromagnetic shield and radar coverNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 5040US2025046990A1Electromagnetic shieldNITTO DENKO CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →