Inventor · disambiguated record
Kazuto Fukuma
Also filed as: FUKUMA KAZUTO
3 granted patents·239 citations·filing 1990–1992
78Inventor score
Files withAPPLIED MATERIALS INC3
Top patents by PatentIndex Score
3 records- 0194US5314845ATwo step process for forming void-free oxide layer over stepped surface of semiconductor waferAPPLIED MATERIALS INC·Filed 1990·Granted May 24, 1994·122 cites·24 claims
- 0289US5166101AMethod for forming a boron phosphorus silicate glass composite layer on a semiconductor waferAPPLIED MATERIALS INC·Filed 1991·Granted Nov 24, 1992·73 cites·17 claims
- 0381US5354387ABoron phosphorus silicate glass composite layer on semiconductor waferAPPLIED MATERIALS INC·Filed 1992·Granted Oct 11, 1994·44 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Kazuto Fukuma files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →