Inventor · disambiguated record
Katsunori Funaki
Also filed as: FUNAKI KATSUNORI
14 granted patents·10 pending applications·7 citations·filing 1998–2025
85Inventor score
Top patents by PatentIndex Score
24 records- 0188US12374527B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jul 29, 2025·0 cites·17 claims
- 0287US2025336646A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0382US12249485B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Mar 11, 2025·0 cites·16 claims
- 0481US11837440B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 5, 2023·1 cites·12 claims
- 0578US11664275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 30, 2023·1 cites·9 claims
- 0677US12154826B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 0776US2025022753A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0875US2025201518A1Plasma unit, substrate processing apparatus, method of processing, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0970US8471477B2Substrate processing apparatus and method of manufacturing semiconductor deviceTOMITA MASAYUKI·Filed 2011·Granted Jun 25, 2013·3 cites·10 claims
- 1068US11869748B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 9, 2024·0 cites·13 claims
- 1168US9059229B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Jun 16, 2015·2 cites·7 claims
- 1256US2024194476A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1355US12040161B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 1455US2024087927A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1554US11908682B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1651US2023201889A1Cleaning method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1750US2023097621A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1848US2022301863A1Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1947US11081362B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·17 claims
- 2047US10796900B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·0 cites·15 claims
- 2146US2022139675A1Method of Manufacturing Semiconductor Device, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2243US11189483B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 2342US11152476B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
- 2427US2003205202A1Plasma cvd deviceKOKUSAI ELECTRIC CO LTD·Filed 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →