Inventor · disambiguated record
Karsten Guth
Also filed as: GUTH KARSTEN
17 granted patents·2 pending applications·46 citations·filing 2007–2022
91Inventor score
Top patents by PatentIndex Score
19 records- 0178US7793819B2Apparatus and method for connecting a component with a substrateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·8 cites·10 claims
- 0277US7555832B2Semiconductor chip attachmentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 7, 2009·6 cites·24 claims
- 0375US8586420B2Power semiconductor arrangement and method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Nov 19, 2013·4 cites·18 claims
- 0475US8209858B2Method for mounting electronic components on a supportSPECKELS ROLAND·Filed 2007·Granted Jul 3, 2012·8 cites·10 claims
- 0575US7682875B2Method for fabricating a module including a sintered jointINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 23, 2010·6 cites·19 claims
- 0674US8563364B2Method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Oct 22, 2013·4 cites·25 claims
- 0772US9768035B2Electronic module and method for producing an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 19, 2017·2 cites·17 claims
- 0862US8415207B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2012·Granted Apr 9, 2013·1 cites·19 claims
- 0962US8253233B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2008·Granted Aug 28, 2012·2 cites·24 claims
- 1060US7757390B2Method for production of a semiconductor componentINFINEON TECHOLOGIES AG·Filed 2007·Granted Jul 20, 2010·2 cites·6 claims
- 1159US8104667B2Method for connecting a component with a substrateGUTH KARSTEN·Filed 2010·Granted Jan 31, 2012·2 cites·20 claims
- 1255US7851334B2Apparatus and method for producing semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·1 cites·21 claims
- 1353US2023411254A1Molded power semiconductor package with gate connector featureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1446US8439249B2Device and method for making a semiconductor device including bonding two bonding partnersSPECKELS ROLAND·Filed 2009·Granted May 14, 2013·0 cites·13 claims
- 1544US8603864B2Method of fabricating a semiconductor deviceRIEDL EDMUND·Filed 2008·Granted Dec 10, 2013·0 cites·5 claims
- 1643US2010068552A1Module including a stable solder jointINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 1742US9214442B2Power semiconductor module, method for producing a power semiconductor module, and semiconductor chipGUTH KARSTEN·Filed 2007·Granted Dec 15, 2015·0 cites·20 claims
- 1840US8637379B2Device including a semiconductor chip and a carrier and fabrication methodEDER HANNES·Filed 2009·Granted Jan 28, 2014·0 cites·20 claims
- 1932US8691624B2Die fixing method and apparatusCILIOX ALEXANDER·Filed 2011·Granted Apr 8, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →