Inventor · disambiguated record
Kazuo Hayakawa
Also filed as: HAYAKAWA KAZUO
14 granted patents·2 pending applications·337 citations·filing 1979–2005
94Inventor score
Top patents by PatentIndex Score
16 records- 0188US5269285AWire saw and slicing method using the sameSHINETSU HANDOTAI KK·Filed 1992·Granted Dec 14, 1993·64 cites·3 claims
- 0283US5937844AMethod for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicingSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 17, 1999·47 cites·14 claims
- 0381US5875769AMethod of slicing semiconductor single crystal ingotSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 2, 1999·46 cites·4 claims
- 0478US6001265ARecovery of coolant and abrasive grains used in slicing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Dec 14, 1999·48 cites·14 claims
- 0565US4259456AOdorless polyolefin resin compositionsLION FAT OIL CO LTD·Filed 1979·Granted Mar 31, 1981·11 cites·2 claims
- 0663US5839425AMethod for cutting a workpiece with a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Nov 24, 1998·21 cites·14 claims
- 0761US5715807AWire sawSHINETSU HANDOTAI KK·Filed 1996·Granted Feb 10, 1998·20 cites·20 claims
- 0859US5575189ARoller having grooves for wire sawSHINETSU HANDOTAI KK·Filed 1995·Granted Nov 19, 1996·20 cites·19 claims
- 0958US7513967B2Molded fiber materials and methods and apparatus for making the sameTOYOTA BOSHOKU KK·Filed 2001·Granted Apr 7, 2009·2 cites·7 claims
- 1057US5927131AMethod of manufacturing wire for use in a wire saw and wire for use in a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Jul 27, 1999·17 cites·11 claims
- 1156US7596604B2Email information providing server, email information providing system, email information providing method and email information providing programDWANGO CO LTD·Filed 2005·Granted Sep 29, 2009·2 cites·8 claims
- 1256US5693596ACutting fluid, method for production thereof, and method for cutting ingotSHINETSU HANDOTAI KK·Filed 1995·Granted Dec 2, 1997·15 cites·8 claims
- 1355US5907988AWire saw apparatusSHINETSU HANDOTAI KK·Filed 1997·Granted Jun 1, 1999·18 cites·10 claims
- 1445US2007073714A1Information providing server, information providing system, information providing method and information providing programDWANGO CO LTD·Filed 2005·Application pending·0 cites
- 1545US2007027918A1Mail processing server, mail processing method, and mail processing programDWANGO CO LTD·Filed 2005·Application pending·0 cites
- 1643US5660650AMethod and apparatus for correcting the hardening deformation of annular elementsNSK LTD·Filed 1995·Granted Aug 26, 1997·6 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →