Inventor · disambiguated record
Katsura Hayashi
Also filed as: HAYASHI KATSURA
33 granted patents·10 pending applications·1,075 citations·filing 1988–2019
97Inventor score
Files withKYOCERA CORP30HAYASHI KATSURA7NIPPON CATALYTIC CHEM IND2ASAHI CHEMICAL IND1HATANAKA HIDEFUMI1
Top patents by PatentIndex Score
43 records- 0198US6359235B1Electrical device mounting wiring board and method of producing the sameKYOCERA CORP·Filed 2000·Granted Mar 19, 2002·184 cites·10 claims
- 0296US6370013B1Electric element incorporating wiring boardKYOCERA CORP·Filed 2000·Granted Apr 9, 2002·219 cites·27 claims
- 0394US6413620B1Ceramic wiring substrate and method of producing the sameKYOCERA CORP·Filed 2000·Granted Jul 2, 2002·90 cites·19 claims
- 0494US6207259B1Wiring boardKYOCERA CORP·Filed 1999·Granted Mar 27, 2001·174 cites·10 claims
- 0593US6143116AProcess for producing a multi-layer wiring boardKYOCERA CORP·Filed 1997·Granted Nov 7, 2000·153 cites·8 claims
- 0691US6663946B2Multi-layer wiring substrateKYOCERA CORP·Filed 2002·Granted Dec 16, 2003·69 cites·20 claims
- 0791US6451441B1Film with metal foilKYOCERA CORP·Filed 2000·Granted Sep 17, 2002·45 cites·8 claims
- 0885US9165849B2Electronic deviceHATANAKA HIDEFUMI·Filed 2011·Granted Oct 20, 2015·9 cites·12 claims
- 0979US7271476B2Wiring substrate for mounting semiconductor componentsKYOCERA CORP·Filed 2004·Granted Sep 18, 2007·20 cites·10 claims
- 1078US8461462B2Circuit substrate, laminated board and laminated sheetHAYASHI KATSURA·Filed 2010·Granted Jun 11, 2013·4 cites·10 claims
- 1178US6384151B1Dicyclopentadiene-modified unsaturated polyester and process for producing the same as well as resin composition and molding material each containing unsaturated polyesterNIPPON CATALYTIC CHEM IND·Filed 2000·Granted May 7, 2002·21 cites·14 claims
- 1277US9936583B2Wiring board and mounting structure using the sameKYOCERA CORP·Filed 2014·Granted Apr 3, 2018·3 cites·9 claims
- 1376US8802996B2Wiring board and mounting structure thereofHAYASHI KATSURA·Filed 2011·Granted Aug 12, 2014·3 cites·9 claims
- 1476US6455784B1Curable sheet for circuit transferASAHI CHEMICAL IND·Filed 2000·Granted Sep 24, 2002·20 cites·6 claims
- 1571US9578738B2Wiring board and mounting: structure including the sameKYOCERA CORP·Filed 2013·Granted Feb 21, 2017·2 cites·5 claims
- 1670US8446734B2Circuit board and mounting structureHAYASHI KATSURA·Filed 2007·Granted May 21, 2013·6 cites·4 claims
- 1769US8431832B2Circuit board, mounting structure, and method for manufacturing circuit boardNAGASAWA TADASHI·Filed 2008·Granted Apr 30, 2013·4 cites·5 claims
- 1867US5082809AHigh-strength alumina sintered body and process for preparation thereofKYOCERA CORP·Filed 1988·Granted Jan 21, 1992·18 cites·8 claims
- 1966US8975529B2Interposer and electronic device using the sameHAYASHI KATSURA·Filed 2011·Granted Mar 10, 2015·2 cites·14 claims
- 2064US6936336B2Transfer sheet and production method of the same and wiring board and production method of the sameKYOCERA CORP·Filed 2003·Granted Aug 30, 2005·10 cites·6 claims
- 2163US6866739B2Film with metal foilKYOCERA CORP·Filed 2002·Granted Mar 15, 2005·3 cites·12 claims
- 2260US9485877B2Structure for circuit board used in electronic devices and method for manufacturing the sameHAYASHI KATSURA·Filed 2010·Granted Nov 1, 2016·1 cites·12 claims
- 2360US8045829B2Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring boardKYOCERA CORP·Filed 2006·Granted Oct 25, 2011·2 cites·13 claims
- 2459US8012561B2Fiber-reinforced resin and method for manufacturing the sameKYOCERA CORP·Filed 2008·Granted Sep 6, 2011·2 cites·7 claims
- 2556US10744575B2Tip and drillKYOCERA CORP·Filed 2017·Granted Aug 18, 2020·0 cites·8 claims
- 2655US8975537B2Circuit substrate, laminated board and laminated sheetKYOCERA CORP·Filed 2013·Granted Mar 10, 2015·0 cites·13 claims
- 2753US12202970B2Thermoplastic composition, electrical wire and article comprising the electrical wireSHPP GLOBAL TECH BV·Filed 2019·Granted Jan 21, 2025·0 cites·17 claims
- 2852US10792738B2Cutting tool and method of manufacturing machined productKYOCERA CORP·Filed 2017·Granted Oct 6, 2020·0 cites·15 claims
- 2952US2016242283A1Wiring board, and mounting structure and laminated sheet using the sameKYOCERA CORP·Filed 2014·Application pending·0 cites
- 3052US2007285907A1Wiring Board and Semiconductor DeviceKYOCERA CORP·Filed 2007·Application pending·0 cites
- 3148US9693451B2Wiring board, mounting structure using same, and method of manufacturing wiring boardKYOCERA CORP·Filed 2013·Granted Jun 27, 2017·0 cites·5 claims
- 3247US2010065318A1Circuit board and semiconductor element mounted structure using the sameKYOCERA CORP·Filed 2007·Application pending·0 cites
- 3346US5360772ACeramic material reinforced by the incorporation of TiC, TiCN and TiN whiskers and processes for production thereofKYOCERA CORP·Filed 1991·Granted Nov 1, 1994·8 cites·30 claims
- 3444US9807874B2Wiring substrate, component embedded substrate, and package structureKYOCERA CORP·Filed 2012·Granted Oct 31, 2017·0 cites·16 claims
- 3544US2013149514A1Insulating sheet, method of manufacturing the same, and method of manufacturing structure using the insulating sheetHAYASHI KATSURA·Filed 2011·Application pending·0 cites
- 3643US2019111496A1Cutting tool tip, cutting tool, and method for producing cut workpiece using sameKYOCERA CORP·Filed 2017·Application pending·0 cites
- 3743US2012189818A1Structure and method for manufacturing the sameHAYASHI KATSURA·Filed 2010·Application pending·0 cites
- 3843US2015366077A1Method for producing mounted structureKYOCERA CORP·Filed 2013·Application pending·0 cites
- 3941US2013043067A1Wire Substrate StructureKYOCERA CORP·Filed 2012·Application pending·0 cites
- 4039US2011232953A1Circuit board and structure using the sameKYOCERA CORP·Filed 2011·Application pending·0 cites
- 4136US9814136B2Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring boardKYOCERA CORP·Filed 2013·Granted Nov 7, 2017·0 cites·6 claims
- 4233US2010255286A1Method for manufacturing resin substrateKYOCERA CORP·Filed 2010·Application pending·0 cites
- 4326US5834547AMolding compound composition, molding compound containing the same, and method for producing the molding compoundNIPPON CATALYTIC CHEM IND·Filed 1996·Granted Nov 10, 1998·3 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →