Inventor · disambiguated record
Kazushi Higashi
Also filed as: HIGASHI KAZUSHI
31 granted patents·4 pending applications·420 citations·filing 1995–2009
97Inventor score
Top patents by PatentIndex Score
35 records- 0190US7554126B2Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting devicePANASONIC CORP·Filed 2005·Granted Jun 30, 2009·25 cites·13 claims
- 0290US5686353ASemiconductor device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 11, 1997·119 cites·12 claims
- 0387US7615406B2Electronic device package manufacturing method and electronic device packagePANASONIC CORP·Filed 2006·Granted Nov 10, 2009·18 cites·14 claims
- 0480US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 0579US6467670B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 22, 2002·19 cites·18 claims
- 0679US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 0777US7692292B2Packaged electronic element and method of producing electronic element packagePANASONIC CORP·Filed 2004·Granted Apr 6, 2010·18 cites·5 claims
- 0877US6193136B1Component mounting method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 27, 2001·32 cites·23 claims
- 0975US7219419B2Component mounting apparatus including a polishing deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 22, 2007·15 cites·22 claims
- 1074US7549567B2Component mounting tool, and method and apparatus for mounting component using this toolPANASONIC CORP·Filed 2007·Granted Jun 23, 2009·6 cites·17 claims
- 1170US6506222B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 14, 2003·11 cites·13 claims
- 1269US7994634B2Semiconductor element and semiconductor element fabrication methodPANASONIC CORP·Filed 2009·Granted Aug 9, 2011·4 cites·14 claims
- 1366US7790594B2Electronic part and method of producing the samePANASONIC CORP·Filed 2008·Granted Sep 7, 2010·3 cites·12 claims
- 1465US8129739B2Semiconductor light emitting device and semiconductor light emitting device mounted boardHIGASHI KAZUSHI·Filed 2006·Granted Mar 6, 2012·4 cites·13 claims
- 1563US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 1663US6332268B1Method and apparatus for packaging IC chip, and tape-shaped carrier to be used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 25, 2001·21 cites·38 claims
- 1760US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 1859US8077447B2Electronic element package and method of manufacturing the sameHIGASHI KAZUSHI·Filed 2007·Granted Dec 13, 2011·2 cites·3 claims
- 1958US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 2058US6439447B1Bump joining judging device and method, and semiconductor component production device and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 27, 2002·23 cites·40 claims
- 2155US8240539B2Joining apparatus with UV cleaningHIGASHI KAZUSHI·Filed 2005·Granted Aug 14, 2012·1 cites·1 claims
- 2252US6825055B2Method for assembling integral type electronic component and integral type electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 30, 2004·3 cites·13 claims
- 2350US6996889B2Electronic part mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·2 cites·7 claims
- 2450US6572005B2Bump-joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 3, 2003·3 cites·6 claims
- 2548US7955974B2Formation of a through-electrode by inkjet deposition of resin pastesPANASONIC CORP·Filed 2009·Granted Jun 7, 2011·0 cites·8 claims
- 2648US2006081974A1Electronic part mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2743US2005001315A1Method for assembling integral type electronic device, and integral type electronic deviceFiled 2004·Application pending·0 cites
- 2843US2011057326A1Method for forming through electrode and semiconductor deviceKAI TAKAYUKI·Filed 2009·Application pending·0 cites
- 2942US6321973B1Bump joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·8 cites·2 claims
- 3041US6264704B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 24, 2001·7 cites·14 claims
- 3140US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
- 3240US2003205607A1Bump joining methodFiled 2003·Application pending·0 cites
- 3339US7646095B2Semiconductor devicePANASONIC CORP·Filed 2004·Granted Jan 12, 2010·0 cites·8 claims
- 3438US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims
- 3537US6590199B2Optical information processing apparatus for use in Optical Computing, Optical image processing, and likeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jul 8, 2003·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →