Electronic part mounting apparatus and method

Abstract

An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, amounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

1 . A method of mounting an electronic part on a substrate comprising the steps of: 
 cleaning said substrate and said electronic part by plasma; and    mounting said electronic part on said substrate in a state that said electronic part and said substrate are exposed in atmospheric air.    
   
   
       2 . A method of mounting an electronic part on a substrate according to  claim 1 , wherein said mounting step is executed within 10 minutes after said cleaning step is executed and said electronic part and said substrate are put in the atmospheric air.  
   
   
       3 . A method of mounting an electronic part on a substrate according to  claim 1 , wherein said mounting step is executed within 5 minutes after said cleaning step is executed and said electronic part and said substrate are put in the atmospheric air.  
   
   
       4 . A method of mounting an electronic part on a substrate according to  claim 1 , wherein said mounting step is executed within 3 minutes after said cleaning step is executed and said electronic part and said substrate are put in the atmospheric air.  
   
   
       5 . A method of mounting an electronic part on a substrate according to  claim 1 , further comprising a step of heating either of said electronic part and said substrate after said cleaning step is executed.