Inventor · disambiguated record
Tatsuo Sasaoka
Also filed as: SASAOKA TATSUO
20 granted patents·2 pending applications·74 citations·filing 2000–2019
92Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD8PANASONIC IP MAN CO LTD6MINAMIO MASANORI3PANASONIC CORP3HIGASHI KAZUSHI1
Top patents by PatentIndex Score
22 records- 0179US8686545B2Semiconductor device and method for manufacturing the sameMINAMIO MASANORI·Filed 2011·Granted Apr 1, 2014·5 cites·17 claims
- 0278US9030003B2Encapsulated semiconductor device and method for manufacturing the sameMINAMIO MASANORI·Filed 2012·Granted May 12, 2015·4 cites·10 claims
- 0375US9240369B2Encapsulated semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 19, 2016·2 cites·11 claims
- 0471US7968800B2Passive component incorporating interposerPANASONIC CORP·Filed 2007·Granted Jun 28, 2011·5 cites·6 claims
- 0571US6902101B2Bump bonding method apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 7, 2005·15 cites·16 claims
- 0669US6474538B1Bonding apparatus and bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 5, 2002·16 cites·27 claims
- 0765US9246073B2Mounting structure, and method of manufacturing mounting structureSASAOKA TATSUO·Filed 2009·Granted Jan 26, 2016·5 cites·20 claims
- 0864US6667250B2Film substrate treatment apparatus, film substrate treatment method, and film substrate transport methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 23, 2003·9 cites·17 claims
- 0955US10629792B2Wiring substrate and production method thereofPANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·9 claims
- 1055US8240539B2Joining apparatus with UV cleaningHIGASHI KAZUSHI·Filed 2005·Granted Aug 14, 2012·1 cites·1 claims
- 1154US10679920B2Semiconductor device having semiconductor package in a wiring board openingPANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·10 claims
- 1250US6996889B2Electronic part mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·2 cites·7 claims
- 1350US6712111B2Bonding method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 30, 2004·4 cites·20 claims
- 1449US9013029B2Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the sameMINAMIO MASANORI·Filed 2012·Granted Apr 21, 2015·0 cites·8 claims
- 1549US6949144B2Low pressure plasma processing apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 27, 2005·4 cites·6 claims
- 1648US11011319B2Electronic componentPANASONIC IP MAN CO LTD·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1748US2006081974A1Electronic part mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 1845US6680221B2Bare chip mounting method and bare chip mounting systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·2 cites·20 claims
- 1944US7907420B2Bare chip mounted structure and mounting methodPANASONIC CORP·Filed 2006·Granted Mar 15, 2011·0 cites·5 claims
- 2042US2017341188A1Solder materialPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 2140US7659148B2Bonding method and apparatusPANASONIC CORP·Filed 2005·Granted Feb 9, 2010·0 cites·13 claims
- 2237US11056632B2Thermoelectric conversion substrate, thermoelectric conversion module and method for producing thermoelectric conversion substratePANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →