Inventor · disambiguated record
Katsuro Hiraiwa
Also filed as: HIRAIWA KATSURO
4 granted patents·1 pending application·220 citations·filing 1992–2007
80Inventor score
Top patents by PatentIndex Score
5 records- 0194US6215182B1Semiconductor device and method for producing the sameFUJITSU LTD·Filed 2000·Granted Apr 10, 2001·141 cites·6 claims
- 0278US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 0371US7659937B2Camera module equipped with an optical filter having an edge not in contact with a fixing portionFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Feb 9, 2010·3 cites·3 claims
- 0471US5230759AProcess for sealing a semiconductor deviceFUJITSU LTD·Filed 1992·Granted Jul 27, 1993·52 cites·6 claims
- 0547US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →