Inventor · disambiguated record
Kazuya Hisano
Also filed as: HISANO KAZUYA
12 granted patents·4 pending applications·8 citations·filing 2009–2025
82Inventor score
Top patents by PatentIndex Score
16 records- 0193US11823922B2Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2023·Granted Nov 21, 2023·2 cites·10 claims
- 0279US11609502B2Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2020·Granted Mar 21, 2023·1 cites·19 claims
- 0361US9025852B2Substrate inspection apparatus and method for operating the sameHISANO KAZUYA·Filed 2012·Granted May 5, 2015·1 cites·20 claims
- 0460US8855402B2Image creation method, substrate inspection method, non-transitory recording medium having program recorded thereon for executing image creation method or substrate inspection method, and substrate inspection apparatusTOMITA HIROSHI·Filed 2012·Granted Oct 7, 2014·2 cites·12 claims
- 0558US2025372419A1Substrate liquid processing apparatus, substrate liquid processing method, and image processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0655US8212869B2Substrate inspection method, substrate inspection system and storage mediumIWANAGA SHUJI·Filed 2009·Granted Jul 3, 2012·2 cites·9 claims
- 0753US2024416450A1Processing method and processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0852US8040500B2Defect inspection method and computer-readable storage mediumTOKYO ELECTRON LTD·Filed 2009·Granted Oct 18, 2011·0 cites·20 claims
- 0949US11669955B2Substrate defect inspection method, storage medium, and substrate defect inspection apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Jun 6, 2023·0 cites·18 claims
- 1049US2021053150A1Laser processing device and laser processing methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1147US12230540B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Feb 18, 2025·0 cites·15 claims
- 1244US11268912B2Substrate inspection method and substrate inspection apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Mar 8, 2022·0 cites·6 claims
- 1342US12087588B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 10, 2024·0 cites·21 claims
- 1442US11378388B2Substrate inspection method, substrate inspection apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2019·Granted Jul 5, 2022·0 cites·8 claims
- 1542US2014124479A1Method of removing coating film of substrate peripheral portion, substrate processing apparatus and non-transitory storage mediumTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1640US12191168B2Laser processing device, laser processing system and laser processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Jan 7, 2025·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →