Inventor · disambiguated record
Kai-Kuang Ho
Also filed as: HO KAI K · HO KAI-KUANG
22 granted patents·33 pending applications·516 citations·filing 1993–2025
95Inventor score
Files withUNITED MICROELECTRONICS CORP44HO KAI-KUANG3C & D CHARTER HOLDINGS INC1HSUAN MIN-CHIH1LIN ZONG-HUEI1
Top patents by PatentIndex Score
55 records- 0195US7387950B1Method for forming a metal structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 17, 2008·31 cites·10 claims
- 0293US6429532B1Pad designUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 6, 2002·92 cites·8 claims
- 0391US6204562B1Wafer-level chip scale packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·162 cites·10 claims
- 0491US6043109AMethod of fabricating wafer-level packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 28, 2000·148 cites·17 claims
- 0578US2025218995A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0678US2025218994A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0778US2025218997A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0878US2025218996A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0977US7649268B2Semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·4 cites·10 claims
- 1077US2025286020A1Semiconductor bonding structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1177US2025286018A1Method of fabricating semiconductor bonding structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1277US2025286021A1Semiconductor packageUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1376US12482777B2Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 25, 2025·0 cites·6 claims
- 1473US2025372541A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1573US2025286019A1Semiconductor packageUNITED MICROELECTORNICS CORP·Filed 2025·Application pending·0 cites
- 1672US7534653B2Chip packaging processUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 19, 2009·4 cites·10 claims
- 1772US6965517B2Component substrate for a printed circuit board and method of assembyling the substrate and the circuit boardC & D CHARTER HOLDINGS INC·Filed 2002·Granted Nov 15, 2005·21 cites·13 claims
- 1871US2024063774A1Surface acoustic wave deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1970US9502366B2Semiconductor structure with UBM layer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·3 cites·11 claims
- 2070US2025028116A1Silicon photonics structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2170US2024170332A1Wafer with test structure and method of dicing waferUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2269US2024120316A1Semiconductor package, semiconductor bonding structure, and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2366US7241678B2Integrated die bumping processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 10, 2007·3 cites·15 claims
- 2464US11848660B2Surface acoustic wave device fabrication methodUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 19, 2023·0 cites·9 claims
- 2559US7268440B2Fabrication of semiconductor integrated circuit chipsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 11, 2007·2 cites·4 claims
- 2659US7211500B2Pre-process before cutting a wafer and method of cutting a waferUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 1, 2007·6 cites·13 claims
- 2759US6545350B2Integrated circuit packages and the method for the sameUNITED MICROELECTRONICS CORP·Filed 2001·Granted Apr 8, 2003·8 cites·8 claims
- 2859US2024413136A1Three-dimensional integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2959US2023018710A1Wafer with test structure and method of dicing waferUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 3058US7399695B2Integrated die bumping processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jul 15, 2008·1 cites·10 claims
- 3158US7170167B2Method for manufacturing wafer level chip scale package structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 30, 2007·8 cites·9 claims
- 3257US12417985B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·9 claims
- 3356US2025157868A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3455US7696606B2Metal structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Apr 13, 2010·0 cites·14 claims
- 3554US2009218679A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 3653US12387998B2QFN package and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 3753US2024429093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3853US2025219031A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3952US2008185710A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 4052US2025300020A1Dicing method of semiconductor structure and semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4152US2024347503A1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4249US2024222204A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4346US5446345AMiniature portable flasher lightVISIBILITY SYSTEMS CONNECTICUT·Filed 1993·Granted Aug 29, 1995·23 cites·27 claims
- 4446US2006231932A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2006·Application pending·0 cites
- 4545US2009137097A1Method for dicing waferUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4644US11495510B2Semiconductor device package structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
- 4740US2006071305A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2004·Application pending·0 cites
- 4839US6846697B2Integrated circuit packages and the method for making the sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jan 25, 2005·0 cites·24 claims
- 4939US2005212132A1Chip package and process thereofHSUAN MIN-CHIH·Filed 2004·Application pending·0 cites
- 5039US2006219862A1Compact camera module with reduced thicknessHO KAI-KUANG·Filed 2005·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →