Inventor · disambiguated record
Kazumasa Hori
Also filed as: HORI KAZUMASA
8 granted patents·2 pending applications·44 citations·filing 1985–2023
85Inventor score
Files withMITSUBISHI MATERIALS CORP5KYOWA HAKKO BIO CO LTD2MITSUBISHI METAL CORP1MITSUBISHI SHINDO KK1OISHI KEIICHIRO1
Top patents by PatentIndex Score
10 records- 0193US9512506B2High strength and high conductivity copper alloy rod or wireOISHI KEIICHIRO·Filed 2009·Granted Dec 6, 2016·11 cites·17 claims
- 0284US7524356B2Method for manufacturing low-oxygen copperMITSUBISHI MATERIALS CORP·Filed 2005·Granted Apr 28, 2009·4 cites·8 claims
- 0374US6682824B1Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the sameMITSUBISHI MATERIALS CORP·Filed 2001·Granted Jan 27, 2004·7 cites·7 claims
- 0465US10163539B2High strength and high conductivity copper alloy rod or wireMITSUBISHI SHINDO KK·Filed 2016·Granted Dec 25, 2018·0 cites·16 claims
- 0564US2025270607A1Protein having nampt activity, and method for producing nmnKYOWA HAKKO BIO CO LTD·Filed 2023·Application pending·0 cites
- 0661US2025043255A1Recombinant microorganism used for producing cdp-choline, and method for producing cdp-choline using said recombinant microorganismKYOWA HAKKO BIO CO LTD·Filed 2022·Application pending·0 cites
- 0753US6944930B2Method for manufacturing low-oxygen copperMITSUBISHI MATERIALS CORP·Filed 2001·Granted Sep 20, 2005·4 cites·6 claims
- 0844US4663141AProcess for recovering or purifying seleniumMITSUBISHI METAL CORP·Filed 1985·Granted May 5, 1987·7 cites·7 claims
- 0938US6589473B2Apparatus for manufacturing low-oxygen copperMITSUBISHI MATERIALS CORP·Filed 2001·Granted Jul 8, 2003·3 cites·2 claims
- 1031US5146164AEddy current flaw detection apparatus employing a resonance circuitMITSUBISHI MATERIALS CORP·Filed 1991·Granted Sep 8, 1992·8 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →