Inventor · disambiguated record
Kazuyuki Hozawa
Also filed as: HOZAWA KAZUYUKI
9 granted patents·8 pending applications·49 citations·filing 2001–2025
85Inventor score
Top patents by PatentIndex Score
17 records- 0185US7300833B2Process for producing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Nov 27, 2007·8 cites·3 claims
- 0284US9153495B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2015·Granted Oct 6, 2015·5 cites·6 claims
- 0382US8618667B2Semiconductor device and method of manufacturing the sameTAKEDA KENICHI·Filed 2012·Granted Dec 31, 2013·8 cites·7 claims
- 0482US7144766B2Method of manufacturing semiconductor integrated circuit device having polymetal gate electrodeRENESAS TECH CORP·Filed 2005·Granted Dec 5, 2006·6 cites·5 claims
- 0580US7049187B2Manufacturing method of polymetal gate electrodeRENESAS TECH CORP·Filed 2001·Granted May 23, 2006·19 cites·27 claims
- 0661US8410615B2Semiconductor device and method for manufacturing the sameAOKI MAYU·Filed 2011·Granted Apr 2, 2013·2 cites·20 claims
- 0758US12471392B2Semiconductor detector and method of manufacturing sameHITACHI HIGH TECH ANALYSIS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·4 claims
- 0856US2025306221A1Semiconductor detectorHITACHI HIGH TECH ANALYSIS CORP·Filed 2025·Application pending·0 cites
- 0952US8749028B2Semiconductor device with silicon through electrode and moisture barrierAOKI MAYU·Filed 2009·Granted Jun 10, 2014·1 cites·14 claims
- 1049US11417702B2Semiconductor detector and method of manufacturing the sameHITACHI LTD·Filed 2021·Granted Aug 16, 2022·0 cites·11 claims
- 1148US2013285253A1Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2013·Application pending·0 cites
- 1247US2009230530A1Semiconductor device and method for producing semiconductor deviceELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1343US2006116055A1Resin bond grindstone and method of manufacturing a semiconductor chip using the grindstoneOYU KIYONORI·Filed 2005·Application pending·0 cites
- 1442US2019324160A1X-ray detector and x-ray measurement device using the sameHITACHI LTD·Filed 2018·Application pending·0 cites
- 1542US2008076232A1Method of removing impurities on a grinding surface of a semiconductor wafer, equipment of removing impurities on a grinding surface of a semiconductor wafer, process of manufacture of semiconductor wafer, process of manufacture of semiconductor chip and semiconductor deviceHOZAWA KAZUYUKI·Filed 2007·Application pending·0 cites
- 1640US2016300764A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2013·Application pending·0 cites
- 1735US2012315710A1Method for producing reconstituted wafers and method for producing semiconductor devicesHOZAWA KAZUYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →