Inventor · disambiguated record
Kazumasa Igarashi
Also filed as: IGARASHI KAZUMASA
26 granted patents·11 pending applications·662 citations·filing 1984–2023
96Inventor score
Files withNITTO DENKO CORP17TOKYO ELECTRON LTD7IGARASHI KAZUMASA4HIRAI SHINJI2NITTO ELECTRIC IND CO2
Top patents by PatentIndex Score
37 records- 0194US12080517B2Ignition method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Sep 3, 2024·2 cites·8 claims
- 0294US5990546AChip scale package type of semiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Nov 23, 1999·187 cites·19 claims
- 0393US5814894ASemiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor deviceNITTO DENKO CORP·Filed 1996·Granted Sep 29, 1998·205 cites·28 claims
- 0492US8802547B2Method and apparatus for forming amorphous silicon filmKAKIMOTO AKINOBU·Filed 2012·Granted Aug 12, 2014·13 cites·10 claims
- 0589US6695985B2Electromagnetic wave suppressor sheetNITTO DENKO CORP·Filed 2002·Granted Feb 24, 2004·56 cites·28 claims
- 0685US10025432B2Capacitive touch panelKISHIOKA HIROAKI·Filed 2012·Granted Jul 17, 2018·4 cites·20 claims
- 0784US4520075ASiloxane-modified polyimide precursor and polyimideNITTO ELECTRIC IND CO·Filed 1984·Granted May 28, 1985·47 cites·28 claims
- 0883US6800804B2Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the compositionNITTO DENKO CORP·Filed 2002·Granted Oct 5, 2004·36 cites·16 claims
- 0982US8895414B1Method and apparatus for forming amorphous silicon filmTOKYO ELECTRON LTD·Filed 2014·Granted Nov 25, 2014·4 cites·8 claims
- 1071US8765833B2UV-curable optical resin adhesive compositionIGARASHI KAZUMASA·Filed 2012·Granted Jul 1, 2014·1 cites·3 claims
- 1169US6674016B2Electronic componentNITTO DENKO CORP·Filed 2002·Granted Jan 6, 2004·15 cites·11 claims
- 1267US9777366B2Thin film forming methodTOKYO ELECTRON LTD·Filed 2015·Granted Oct 3, 2017·1 cites·1 claims
- 1365US9145604B2Thin film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Sep 29, 2015·1 cites·22 claims
- 1464US8541099B2Heat-resistant resinFUJII HIROFUMI·Filed 2009·Granted Sep 24, 2013·1 cites·8 claims
- 1558US2023395371A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1656US6383660B2Epoxy resin composition for encapsulating semiconductor and semiconductor device using the sameNITTO DENKO CORP·Filed 2001·Granted May 7, 2002·7 cites·7 claims
- 1754US4499252AProcess for producing polyimide precursorNITTO ELECTRIC IND CO·Filed 1984·Granted Feb 12, 1985·11 cites·12 claims
- 1853US7352069B2Electronic component unitNITTO DENKO CORP·Filed 2003·Granted Apr 1, 2008·5 cites·11 claims
- 1953US2011041914A1Dye-sensitized solar cellNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2052US11781219B2Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Oct 10, 2023·0 cites·5 claims
- 2152US5508742AColor video camera apparatus using a CD includes a matrix circuit having matrix coefficients adjustable independence on the color signalsPHILIPS CORP·Filed 1994·Granted Apr 16, 1996·13 cites·6 claims
- 2252US5053314APositively photosensitive polyimide compositionNITTO DENKO CORP·Filed 1990·Granted Oct 1, 1991·11 cites·3 claims
- 2351US2010059113A1Dye-sensitized solar cellNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2450US11923177B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Mar 5, 2024·0 cites·13 claims
- 2549US7034405B2Resin component for encapsulating semiconductor and semiconductor device using itNITTO DENKO CORP·Filed 2002·Granted Apr 25, 2006·3 cites·6 claims
- 2649US2007293597A1Heat-Resistant ResinNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 2748US5294835AEpoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 1992·Granted Mar 15, 1994·18 cites·8 claims
- 2848US2012260980A1Dye-sensitized solar cell, and seal member to be used for the dye-sensitized solar cellIGARASHI KAZUMASA·Filed 2012·Application pending·0 cites
- 2947US2012017979A1Dye-sensitized solar cellIGARASHI KAZUMASA·Filed 2011·Application pending·0 cites
- 3045US2012115976A1Uv-curable optical resin adhesive compositionIGARASHI KAZUMASA·Filed 2011·Application pending·0 cites
- 3142US6117616ACircuit-forming substrate and circuit substrateNITTO DENKO CORP·Filed 1996·Granted Sep 12, 2000·7 cites·11 claims
- 3241US5120573AProcess for producing metal/polyimide composite articleHITACHI LTD·Filed 1989·Granted Jun 9, 1992·10 cites·9 claims
- 3340US2007196612A1Liquid epoxy resin compositionNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 3439US2010193972A1Spherical sintered ferrite particles, resin composition for semiconductor encapsulation comprising them and semiconductor devices produced by using the sameNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 3536US6333139B1Circuit-forming substrate and circuit substrateNITTO DENKO CORP·Filed 1999·Granted Dec 25, 2001·4 cites·4 claims
- 3632US2007040206A1High dielectric material composed of sintered body of rare earth sulfideHIRAI SHINJI·Filed 2004·Application pending·0 cites
- 3727US2006201161A1Cooling device for electronic component using thermo-electric conversion materialHIRAI SHINJI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →