Inventor · disambiguated record
Kazuki Iizuka
Also filed as: IIZUKA KAZUKI
0 granted patents·2 pending applications·0 citations·filing 2022–2022
Technology areasH10P
Files withDISCO CORP2
Top patents by PatentIndex Score
2 records- 0143US2024243000A1Adhesive sheet for backgrinding, semiconductor wafer manufacturing method, and substrate sheetDISCO CORP·Filed 2022·Application pending·0 cites
- 0243US2024254368A1Adhesive sheet for rear surface grinding, semiconductor wafer manufacturing method, and base material sheetDISCO CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →