Inventor · disambiguated record
Kazuhisa Ikeda
Also filed as: IKEDA KAZUHISA
18 granted patents·5 pending applications·327 citations·filing 1987–2022
94Inventor score
Files withMITSUBISHI CHEM CORP11NIPPON DENSO CO8DENSO CORP2MITSUBISHI RAYON CO1SUMITOMO ELECTRIC INDUSTRIES1
Top patents by PatentIndex Score
23 records- 0191US11312090B2Fiber-reinforced resin molded article and method for manufacturing fiber-reinforced resin molded articleMITSUBISHI CHEM CORP·Filed 2019·Granted Apr 26, 2022·4 cites·20 claims
- 0291US5289721ASemiconductor pressure sensorNIPPON DENSO CO·Filed 1991·Granted Mar 1, 1994·63 cites·16 claims
- 0388US4838089ASemiconductor pressure sensorNIPPON DENSO CO·Filed 1987·Granted Jun 13, 1989·84 cites·13 claims
- 0486US10960612B2Method for manufacturing fiber-reinforced composite material and fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2016·Granted Mar 30, 2021·5 cites·8 claims
- 0581US6267010B1Integrated sensor deviceDENSO CORP·Filed 1997·Granted Jul 31, 2001·46 cites·25 claims
- 0676US2022153923A1Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing sameMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
- 0775US10315343B2Manufacturing method for molded article of fiber-reinforced composite material and molded article of fiber-reinforced composite materialsMITSUBISHI CHEM CORP·Filed 2013·Granted Jun 11, 2019·3 cites·19 claims
- 0875US5386730APressure sensor having a sealed water-resistant constructionNIPPON DENSO CO·Filed 1993·Granted Feb 7, 1995·31 cites·16 claims
- 0973US11292874B2Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing sameMITSUBISHI CHEM CORP·Filed 2019·Granted Apr 5, 2022·0 cites·18 claims
- 1073US5949118AEtching method for silicon substrates and semiconductor sensorNIPPON DENSO CO·Filed 1996·Granted Sep 7, 1999·30 cites·20 claims
- 1164US11421089B2Prepreg sheet, method for manufacturing same, unit layer with a covering material, method for manufacturing fiber-reinforced composite, and fiber-reinforced compositeMITSUBISHI CHEM CORP·Filed 2019·Granted Aug 23, 2022·0 cites·18 claims
- 1260US2021331429A1Method for manufacturing fiber-reinforced composite material and fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 1358US5528214APressure-adjusting device for adjusting output of integrated pressure sensorNIPPON DENSO CO·Filed 1994·Granted Jun 18, 1996·24 cites·4 claims
- 1457US2022040935A1Method for manufacturing molded article of fiber-reinforced composite material, reinforcing fiber substrate and molded article of fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 1556US11787150B2Prepreg sheet and manufacturing method therefor, fiber-reinforced composite material molded article and manufacturing method therefor, and method for manufacturing preformMITSUBISHI CHEM CORP·Filed 2020·Granted Oct 17, 2023·0 cites·14 claims
- 1652US2021276281A1Cloth Prepreg, Method for Manufacturing Cloth Prepreg, Fiber Reinforced Resin Molded Article, and Method for Manufacturing Fiber Reinforced Resin Molded ArticleMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 1750US5421956AMethod of fabricating an integrated pressure sensorNIPPON DENSO CO·Filed 1993·Granted Jun 6, 1995·17 cites·10 claims
- 1845US2020114590A1Method of producing composite laminate, method of producing fiber-reinforced composite material molded product, and fiber-reinforced composite material molded productMITSUBISHI CHEM CORP·Filed 2019·Application pending·0 cites
- 1944US10889074B2Fiber reinforced composite material molding and manufacturing method thereforMITSUBISHI RAYON CO·Filed 2015·Granted Jan 12, 2021·0 cites·12 claims
- 2040US6194236B1Electrochemical etching method for silicon substrate having PN junctionDENSO CORP·Filed 1999·Granted Feb 27, 2001·5 cites·14 claims
- 2140US5684428ASensor apparatus capable of preventing high frequency noiseNIPPON DENSO CO·Filed 1995·Granted Nov 4, 1997·8 cites·17 claims
- 2234US7222118B2Computer program product for accessing database, recording medium recording database access program therein, and database access methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted May 22, 2007·1 cites·21 claims
- 2332US5554881AConstitution of an electrode arrangement in a semiconductor elementNIPPON DENSO CO·Filed 1994·Granted Sep 10, 1996·6 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →