Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

Abstract

A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

1 . A film, comprising a thermosetting resin composition, the thermosetting resin composition comprising:
 an epoxy resin;   an epoxy resin curing agent; and   an epoxy resin curing accelerator comprising a urea derivative,   wherein the epoxy resin curing agent comprises a first curing agent which is an imidazole-based curing agent, not being encapsulated in a microcapsule, and a second curing agent, which is encapsulated in a microcapsule,   wherein the film does not comprise a reinforcing fiber substrate.   
     
     
         2 . The film of  claim 1 , wherein the imidazole-based curing agent of the first curing agent is a compound of formula (1): 
       
         
           
           
               
               
           
         
         wherein R 1  is an optionally substituted linear or branched alkyl group comprising from 1 to 5 carbon atoms, an optionally substituted phenyl group, H, or a hydroxymethyl group, and R 2  is a linear or branched alkyl group having from 1 to 5 carbon atoms, an optionally substituted phenyl group, or H, and 
         wherein the second curing agent is a compound of formula (2): 
       
       
         
           
           
               
               
           
         
         wherein R 3  is an organic group comprising a carbon atom and R 4  to R 6  are independently H, a methyl group, or an ethyl group. 
       
     
     
         3 . The film of  claim 1 , wherein the imidazole-based curing agent of the first curing agent is a compound of formula (1): 
       
         
           
           
               
               
           
         
         wherein 
         R 1  is an optionally substituted linear or branched alkyl group comprising from 1 to 5 carbon atoms, an optionally substituted phenyl group, H, or a hydroxymethyl group, and 
         R 2  is a linear or branched alkyl group having from 1 to 5 carbon atoms, an optionally substituted phenyl group, or H. 
       
     
     
         4 . The film of  claim 1 , wherein the urea derivative comprises 3-phenyl-1,1-dimethylurea or 2,4-bis(3,3-dimethylureido)toluene. 
     
     
         5 . The film of  claim 1 , wherein the first curing agent comprises 2-phenyl-4,5-dihydroxymethylimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole. 
     
     
         6 . The film of  claim 1 , wherein the second curing agent has a formula (2): 
       
         
           
           
               
               
           
         
         wherein 
         R 3  is an organic group comprising a carbon atom, and 
         R 4  to R 6  are independently H, a methyl group, or an ethyl group. 
       
     
     
         7 . The film of  claim 1 , wherein the epoxy resin comprises an epoxy resin having a structure unit of formula (3): 
       
         
           
           
               
               
           
         
       
     
     
         8 . The film of  claim 1 , wherein the epoxy resin comprises a bisphenol A type epoxy resin. 
     
     
         9 . The film of  claim 1 , wherein, in mass percent,
 the first curing agent is present in a range of from 5 to 15%,   the second curing agent is present in a range of from 1 to 3%, and   the urea derivative is present in a range of from 2 to 5%,   in the thermosetting resin composition.   
     
     
         10 . The film of  claim 1 , wherein the thermosetting resin composition has a lowest viscosity at from 80° C. to 98° C. in temperature-programmed viscosity measurement to be conducted under conditions of an initial temperature of 30° C. and a rate of temperature increase of 2.0° C./min, and
 wherein the thermosetting resin composition has a glass transition temperature of a cured product obtained by heating the thermosetting resin composition at 140° C. for 5 minutes attained by dynamic viscoelasticity measurement of 150° C. or higher. 
 
     
     
         11 . The film of  claim 1 , wherein the content of the thermosetting resin composition is in a range of from 30 to 150 g/m 2 . 
     
     
         12 . The film of  claim 1 , having a thickness in a range of from 20 to 400 μm. 
     
     
         13 . A method for producing a fiber-reinforced plastic molded body, the method comprising:
 preparing a laminate comprising the film of  claim 1  and a plurality of sheet-like prepreg substrates such that the film is arranged on one surface of the laminate; and   subjecting the laminate to a heat and pressure treatment using a mold.   
     
     
         14 . The method of  claim 13 , further comprising:
 shaping the laminate into a preform before subjecting the laminate to the heat and pressure treatment.