Inventor · disambiguated record
Kazuhiro Isaka
Also filed as: ISAKA KAZUHIRO
5 granted patents·1 pending application·29 citations·filing 1998–2011
76Inventor score
Top patents by PatentIndex Score
6 records- 0182US7879445B2Adhesive for bonding circuit members, circuit board and process for its productionHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·8 cites·9 claims
- 0271US7247381B1Adhesive for bonding circuit members, circuit board, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 24, 2007·21 cites·17 claims
- 0354US8252419B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Aug 28, 2012·0 cites·6 claims
- 0454US2009314533A1Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2009·Application pending·0 cites
- 0550US8273458B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 0650US8273457B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →