Adhesive for bonding circuit members, circuit board and process for its production

Abstract

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

1 . An adhesive for bonding circuit members, having a property that it can be positioned between circuit electrodes facing each other, said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically by direct contact in the direction of pressing, and
 said adhesive comprising an adhesive resin composition and an inorganic filler, said inorganic filler being contained in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition.   
     
     
         2 . An adhesive for bonding circuit members, having a property that it can be positioned between circuit electrodes facing each other, said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically by direct contact in the direction of pressing, and
 said adhesive being in multi-layer constitution having a first adhesive layer comprising an adhesive resin composition and an inorganic filler and containing the inorganic filler in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition, and a second adhesive layer containing an adhesive resin composition as a main ingredient.   
     
     
         3 . An adhesive for bonding circuit members, having a property that it can be positioned between circuit electrodes facing each other, said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically by direct contact in the direction of pressing, and
 said adhesive being in multi-layer constitution having:   a first adhesive layer comprising an adhesive resin composition and an inorganic filler and containing the inorganic filler in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition; and   a second adhesive layer containing an adhesive resin composition and having a modulus of elasticity of from 100 to 2,000 MPa at 40° C. after curing.   
     
     
         4 . An adhesive for bonding circuit members, having a property that it can be positioned between circuit electrodes facing each other, said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically by direct contact in the direction of pressing, and
 said adhesive comprising an adhesive resin composition and an inorganic filler, said adhesive having an average coefficient of thermal expansion of 200 ppm/° C. or below at 110 to 130° C. after curing.   
     
     
         5 . The adhesive for bonding circuit members according to  claim 4 , which has an average coefficient of thermal expansion of from 30 to 200 ppm/° C. at 110 to 130° C. after curing of the adhesive. 
     
     
         6 . An adhesive for bonding circuit members, having a property that it can be positioned between circuit electrodes facing each other; said circuit electrodes facing each other being pressed interposing the adhesive between them, to interconnect the electrodes electrically by direct contact in the direction of pressing, and
 said adhesive being in multi-layer constitution having a third adhesive layer and a fourth adhesive layer which have physical properties different in value from each other.   
     
     
         7 . The adhesive for bonding circuit members according to  claim 6 , wherein said third adhesive layer has a modulus of elasticity after curing which is higher than the modulus of elasticity after curing of said fourth adhesive layer. 
     
     
         8 . The adhesive for bonding circuit members according to  claim 7 , wherein said fourth adhesive layer has a modulus of elasticity of from 100 to 2,000 MPa at 40° C. after curing. 
     
     
         9 . The adhesive for bonding circuit members according to  claim 6 , wherein said third adhesive layer has a coefficient of thermal expansion which is smaller than the coefficient of thermal expansion of the fourth adhesive layer. 
     
     
         10 . The adhesive for bonding circuit members according to  claim 9 , wherein said third adhesive layer has a coefficient of thermal expansion at 30 to 100° C., of from 20 to 70 ppm/° C. 
     
     
         11 . The adhesive for bonding circuit members according to  claim 6 , wherein said third adhesive layer has a glass transition temperature which is higher than the glass transition temperature of the fourth adhesive layer. 
     
     
         12 . The adhesive for bonding circuit members according to  claim 11 , wherein said third adhesive layer has a glass transition temperature of 120° C. or above. 
     
     
         13 . The adhesive for bonding circuit members according to  claim 7 , wherein at least one layer, of said third and fourth adhesive layers, contains:
 an adhesive resin composition; and   an inorganic filler in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition.   
     
     
         14 . The adhesive for bonding circuit members according to  claim 1 , wherein said inorganic filler has an average particle diameter of 3 mm or smaller. 
     
     
         15 . The adhesive for bonding circuit members according to  claim 1 , which has a modulus of elasticity of from 30 to 2,000 MPa at 40° C. after the curing of the adhesive resin composition. 
     
     
         16 . The adhesive for bonding circuits according to  claim 1 , wherein said adhesive resin composition contains an epoxy resin and a latent curing agent. 
     
     
         17 . The adhesive for bonding circuit members according to  claim 1 , wherein said adhesive resin composition contains an epoxy resin, an acrylic rubber and a latent curing agent. 
     
     
         18 . The adhesive for bonding circuit members according to  claim 17 , wherein said acrylic rubber contains a glycidyl ether group in the molecule 
     
     
         19 . The adhesive for bonding circuit members according to  claim 1 , which has the form of a film. 
     
     
         20 . A circuit board comprising:
 a first circuit member having a first connecting terminal; and   a second circuit member having a second connecting terminal;   said first connecting terminal and the second connecting terminal being disposed facing each other, and an adhesive being positioned between the first connecting terminal and the second connecting terminal which are disposed facing each other; and   said first connecting terminal and the second connecting terminal disposed facing each other being electrically interconnected by pressing, said adhesive being the adhesive for bonding circuit members according to  claim 1 .   
     
     
         21 . The circuit board according to  claim 20 , wherein:
 said first circuit member is an inorganic insulating substrate;   said second circuit member is an organic insulating substrate;   said adhesive is an adhesive, for bonding circuit members, being in multi-layer constitution having a first adhesive layer comprising an adhesive resin composition and an inorganic filler and containing the inorganic filler in an amount of from 10 to 200 parts by weight based on 100 parts by weight of the adhesive resin composition, and a second adhesive layer containing an adhesive resin composition as a main ingredient; and   at least any of said first adhesive layer stands adhered on the side of said first circuit member.   
     
     
         22 . The circuit board according to  claim 20 , wherein;
 said first circuit member is an inorganic insulating substrate;   said second circuit member is an organic insulating substrate;   said adhesive is an adhesive for bonding circuit members, said adhesive being in multi-layer constitution having a third adhesive layer and a fourth adhesive layer which have physical properties different in value from each other, and wherein said third adhesive layer has a modulus of elasticity after curing which is higher than the modulus of elasticity after curing of said fourth adhesive layer; and   at least any of said third adhesive layer stands adhered on the side of said first circuit member.   
     
     
         23 . The circuit board according to  claim 21 , wherein;
 said first circuit member is a semiconductor chip.   
     
     
         24 . A process for producing a circuit board, comprising the steps of:
 disposing a first circuit member comprised of an inorganic insulating substrate, having a first connecting terminal, and a second circuit member comprised of an organic insulating substrate, having a second connecting terminal, in such a way that the first connecting terminal and the second connecting terminal face each other, said circuit members being so disposed that the adhesive for bonding circuit members according to  claim 2  is positioned between said first connecting terminal and said second connecting terminal which have been disposed facing each other, in such a way that said first adhesive layer is on the side of said first circuit member; and   pressing the resultant circuit members to electrically interconnect said first connecting terminal and said second connecting terminal disposed facing each other by direct contact.   
     
     
         25 . A process for producing a circuit board, comprising the steps of:
 disposing a first circuit member comprised of an inorganic insulating substrate, having a first connecting terminal, and a second circuit member comprised of an organic insulating substrate, having a second connecting terminal, in such a way that the first connecting terminal and the second connecting terminal face each other, said circuit members being so disposed that the adhesive for bonding circuit members according to  claim 7  is positioned between said first connecting terminal and said second connecting terminal which have been disposed facing each other, in such a way that said third adhesive layer is on the side of said first circuit member; and   pressing the resultant circuit members to electrically interconnect said first connecting terminal and said second connecting terminal disposed facing each other by direct contact.