Inventor · disambiguated record
Kazuyoshi Kojima
Also filed as: KOJIMA KAZUYOSHI
21 granted patents·7 pending applications·762 citations·filing 1987–2011
96Inventor score
Files withHITACHI CHEMICAL CO LTD14MITSUBISHI ELECTRIC CORP4WATANABE ITSUO4ARIFUKU MOTOHIRO3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2
Top patents by PatentIndex Score
28 records- 0195US5622567AThin film forming apparatus using laserMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 22, 1997·147 cites·3 claims
- 0291US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0388US6110291AThin film forming apparatus using laserMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 29, 2000·67 cites·3 claims
- 0482US7879445B2Adhesive for bonding circuit members, circuit board and process for its productionHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·8 cites·9 claims
- 0582US7298733B2Internet communication system, internet communication method, session management server, radio communication device, communication relay server, and programIP TALK CORP·Filed 2002·Granted Nov 20, 2007·63 cites·23 claims
- 0682US6034331AConnection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1996·Granted Mar 7, 2000·60 cites·20 claims
- 0780US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 0879US8043709B2Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Oct 25, 2011·23 cites·13 claims
- 0978US6328844B1Filmy adhesive for connecting circuits and circuit boardHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·53 cites·26 claims
- 1077US6033741AThin film forming apparatus using laserMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 7, 2000·32 cites·6 claims
- 1176US6379995B1Method of making a solar batteryMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 30, 2002·25 cites·5 claims
- 1272US8202622B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2009·Granted Jun 19, 2012·4 cites·9 claims
- 1372US6338195B1Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jan 15, 2002·37 cites·19 claims
- 1471US7247381B1Adhesive for bonding circuit members, circuit board, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 24, 2007·21 cites·17 claims
- 1567US8132319B2Circuit connecting methodARIFUKU MOTOHIRO·Filed 2008·Granted Mar 13, 2012·3 cites·12 claims
- 1661USD315154STransportable phoneMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Mar 5, 1991·10 cites·1 claims
- 1754US8252419B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Aug 28, 2012·0 cites·6 claims
- 1854US2009314533A1Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2009·Application pending·0 cites
- 1950US8501045B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2011·Granted Aug 6, 2013·0 cites·20 claims
- 2050US8273458B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 2150US8273457B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 2248US2010307805A1Circuit connecting material, connection structure and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 2348US2010277884A1Circuit-connecting material and circuit terminal connection structureHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 2447US2010139947A1Circuit-connecting material, and connection structure for circuit memberHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 2542US2010025097A1Circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 2640US2011267791A1Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection materialHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 2739US2010140556A1Filmy adhesive for circuit connectionHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 2833USD306311SElectronic calculatorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1987·Granted Feb 27, 1990·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →