Inventor · disambiguated record
Itsuo Watanabe
Also filed as: WATANABE ITSUO
38 granted patents·4 pending applications·1,052 citations·filing 1992–2011
98Inventor score
Top patents by PatentIndex Score
42 records- 0194US7629050B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Dec 8, 2009·11 cites·8 claims
- 0294US7241644B2Adhesive, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jul 10, 2007·28 cites·12 claims
- 0393US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0493US6281450B1Substrate for mounting semiconductor chipsHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 28, 2001·206 cites·9 claims
- 0591US6939913B1Adhesive agent, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2000·Granted Sep 6, 2005·30 cites·13 claims
- 0691US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0790US7604868B2Electronic circuit including circuit-connecting materialHITACHI CHEMICAL CO LTD·Filed 2005·Granted Oct 20, 2009·16 cites·10 claims
- 0890US7553890B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 30, 2009·11 cites·9 claims
- 0988US6777464B1Circuit connecting material, and structure and method of connecting circuit terminalHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 17, 2004·86 cites·15 claims
- 1087US8115322B2Adhesive, method of connecting wiring terminals and wiring structureARIFUKU MOTOHIRO·Filed 2010·Granted Feb 14, 2012·6 cites·13 claims
- 1187US7777335B2Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particlesHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 17, 2010·11 cites·16 claims
- 1286US7618713B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 17, 2009·11 cites·8 claims
- 1385US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 1484US7785708B2Adhesive film for circuit connection, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 31, 2010·13 cites·24 claims
- 1584US6133534AWiring board for electrical tests with bumps having polymeric coatingHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 2000·56 cites·2 claims
- 1682US7879445B2Adhesive for bonding circuit members, circuit board and process for its productionHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·8 cites·9 claims
- 1782US6034331AConnection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1996·Granted Mar 7, 2000·60 cites·20 claims
- 1880US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 1979US8043709B2Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Oct 25, 2011·23 cites·13 claims
- 2078US7776438B2Adhesive film for circuit connection, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2007·Granted Aug 17, 2010·9 cites·13 claims
- 2178US6328844B1Filmy adhesive for connecting circuits and circuit boardHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·53 cites·26 claims
- 2275US8120189B2Wiring terminal-connecting adhesiveARIFUKU MOTOHIRO·Filed 2008·Granted Feb 21, 2012·1 cites·13 claims
- 2375US7968196B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 28, 2011·1 cites·24 claims
- 2474US6568073B1Process for the fabrication of wiring board for electrical testsHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 27, 2003·37 cites·5 claims
- 2572US8202622B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2009·Granted Jun 19, 2012·4 cites·9 claims
- 2672US6338195B1Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jan 15, 2002·37 cites·19 claims
- 2771US7247381B1Adhesive for bonding circuit members, circuit board, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 24, 2007·21 cites·17 claims
- 2867US7629056B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 8, 2009·12 cites·9 claims
- 2965US7879956B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·0 cites·18 claims
- 3059US7967943B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 28, 2011·0 cites·92 claims
- 3159US5464673AInformation recording medium having recording layer with organic polymer and dye contained thereinHITACHI CHEMICAL CO LTD·Filed 1992·Granted Nov 7, 1995·10 cites·12 claims
- 3254US8252419B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Aug 28, 2012·0 cites·6 claims
- 3354US2009314533A1Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2009·Application pending·0 cites
- 3452US8142605B2Circuit-connecting material and circuit terminal connected structure and connecting methodWATANABE ITSUO·Filed 2011·Granted Mar 27, 2012·0 cites·27 claims
- 3552US5648135AInformation recording medium having recording layer with organic polymer and dye contained thereinHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jul 15, 1997·9 cites·7 claims
- 3650US8501045B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2011·Granted Aug 6, 2013·0 cites·20 claims
- 3750US8273458B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 3850US8273457B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 3949US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 4048US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
- 4141US2010025089A1Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereofTAKETATSU JUN·Filed 2005·Application pending·0 cites
- 4237US6818086B2Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the methodHITACHI CHEMICAL CO LTD·Filed 2001·Granted Nov 16, 2004·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →