Wiring-connecting material and wiring-connected board production process using the same

Abstract

The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

1 . A wiring-connecting material adapted to be interposed between connecting terminals facing each other and with which the connecting terminals are electrically connected in the pressure direction while pressing said connecting terminals facing each other, comprising at least two different types of thermoplastic resin, said at least two different types of thermoplastic resin including a film-forming material which has a weight-average molecular weight of at least 10,000, and a thermoplastic resin which has a weight average molecular weight of at least 350,000, a radical-polymerizable substance, a curing agent generating a free radical upon heating, conductive particles, and a phosphate.  
   
   
       2 . A process for producing a wiring-connected board, comprising a connecting step of interconnecting wiring members each having a connecting terminal, which members are so interconnected that their connecting terminals are able to make conduction between them, 
 said connecting step comprising the step of heating the wiring-connecting material according to  claim 1  while applying a pressure thereto via the wiring members, the wiring-connecting material being held between at least two wiring members so disposed that their sides having the connecting terminals face to each other.    
   
   
       3 . The process for producing a wiring-connected board according to  claim 2 , wherein at least one of the connecting terminals has a surface formed of at least one metal selected from the group consisting of gold, silver and a platinum group metal.  
   
   
       4 . The wiring-connecting material according to  claim 1 , wherein the material is in the form of a film.  
   
   
       5 . The wiring-connecting material according to  claim 1 , wherein said curing agent is a lauroylperoxide.  
   
   
       6 . The wiring-connecting material according to  claim 1 , wherein said conductive particles are included in an amount of from 0.1 to 30% by volume based on total amount of said at least two different types of thermoplastic resin, said radical-polymerizable substance and said curing agent.  
   
   
       7 . The wiring-connecting material according to  claim 1 , wherein said phosphate is a radical-polymerizable substance having a phosphate structure.  
   
   
       8 . A wiring-connected board comprising: 
 at least two wiring members each having a connecting terminal and so disposed that their sides having the connecting terminals face to each other, and    a wiring-connecting material film provided between said wiring members and electrically connecting said wiring members,    said wiring-connecting material film being obtained by heating the wiring-connecting material according to  claim 1  while applying a pressure thereto via said wiring members.